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Those presentations not available are so indicated. |
| Plenary Session
Session Chair: Jose Cobos Univerity de Polytechnic Madrid
Co-Chair: Aleksandar Prodic University of Toronto
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Isik C. Kizilyalli
DOE – ARPA-E |
The Impact of Wide-Bandgap Semiconductor Devices on Future Integrated Power Electronics |
Ravi Mahajan
Intel |
Advanced Packaging Architectures for Heterogeneous Integration |
Tim Phillips
Empower Semiconductor |
Minimizing the Energy Footprint of the Digital Economy With Integrated Voltage Regulators |
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| Session 1: Granular Power
Session Chair: Santosh Kulkarni Dialog Semiconductor
Co-Chairs: Ningning Wang Hangzhou Dianzi Univerity, Rinkle Jain Intel
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Yan Lu
Univerity of Macau |
Distributed Low-Dropout Regulator Designs |
Jens Masuch
Dialog Semiconductor |
Fully Integrated Voltage Regulators Using In-Package and On-Die Inductors to Supply Mobile Processors |
Keith Bowman
Qualcomm |
Adaptive Circuits for Processors & Future Voltage Regulator Designs |
Subhir Kudva
Nvidia |
Power Supply for I/O Blocks: Challenges, Constraints, and Solutions |
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| Session 2: Topologies and Control
Session Chair: Bruno Allard, Universite de Lyon
Co-Chairs: Jason Stauth Dartmouth, Christoper Schaef Intel
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Xavier Branca
ST Microelectronics |
CMOS Laser Diode Driver for Time of Flight Applications |
Marc Cousineau
NXP |
CMOS Active Gate Driver for Fast Control of WGB Power Transistor Commutations |
Aleksandar Prodic
Univerity of Toronto |
Topological and Control Solutions for Reduced Voltage Swing Hybrid Dc-Dc SMPS |
Jason Stauth
Dartmouth |
Hybrid Switched Capacitor Converters: Topologies, Trends, and Comparison |
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| Session 3: Integrated Magnetics
Session Chair: Masahiro Yamaguchi Tohuku University,
Co-Chairs: Hongbin Yu Arizona State University, Dragan Dinulovic Wurth Elektronik, Maeve Duffy National University Ireland Galway
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Lulu Peng
Global Foundries |
Silicon-Based Ultimate Miniature Magnetic Inductors and Transformers (SUMMIT) for High-Frequency Switching Regulator |
Kousuke Miyaji
Shinshu University |
3D-Integrated Magnetics Using Fe-Based Metal Composite Materials for Beyond-10MHz Switching Power Supply |
Malte Paesler
Fraunhofer Institute |
Novel Back-End-of-Line Compatible Method for Integration of Inductances With Magnetic Core in Applications Like DC/DC Converters |
Kaladhar Radhakrishnan
Intel |
Magnetic Inductors for Next Generation IVR |
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| Session 4: Integrated Capacitors and Energy Storage
Session Chair: Mehdi Jatlaoui Murata
Co-Chair: Raj Markondeya Pulugurtha Florida International University
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Shunsuke Abe
Murata |
Integrated Capacitors and Chip-on-Wafer Integration for HPC Applications |
Kenichi Yoshida
TDK |
Low Profile Metallic Foil-Based Capacitor for High Frequency Operation |
Sami Oukassi
Cea Leti |
Integrated Ion Capacitors as an Innovative High Energy/Density Storage Device |
Denis Pasero
Ilika |
Micro Solid State Batteries Enabling Medical Devices and IOT |
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| Session 5: Wideband Gap Integration
Session Chair: Brian Ma Univeristy Texas Dallas
Co-Chair: Bernhard Wicht Leibniz Universitat Hanover
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Bernhard Wicht
Leibniz Universtat Hannover |
Monolithic GaN – Unleashing the Potential by Integrating Power, Sensing and Control |
Elison Matioli
EPFL |
New Technologies for Efficient and Integrated GaN Power Devices
(Not Available) |
Sameer Pendharkar
Texas Instruments |
Reliability Challenges in GaN |
Alex Lidow
EPC |
How the Monolithic Integration of Power, Analog, and Digital Components in GaN-on-Si Technology is Changing Power Conversion |
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| Session 6: System Integrated Manufacturing and Packaging
Session Chair: Baoxing Chen Analog Devices
Co-Chair: Shamala Chickamenahalli Arizona State University
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Lin Cheng
University of Science and Technology of China, Hefei |
A High-Efficiency Transformer-in-Package Isolated DC-DC Converter Using Glass-Based Fan-Out Wafer-Level Packaging |
Keith Bennett
Analog Devices |
System-in-Package, Bridging the Gap Between Fractional Brick and System-on-Chip Power Converters |
Nian Sun
Northeastern University |
High-Performance On-Chip Hot Pressed NdFeB Hard Magnets for MEMS Applications |
Vikas Gupta
ASE |
Automotive Megatrends and Package Technology Solutions |
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| Session 7: Systems and Applications
Session Chair: Francesco Carobolante IoTissimo
Co-Chair: Arnold Knott Technical University of Denmark
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Yasser Nour
Lotus Microsystems |
Power Interposer Technology – A Platform for PSiP and PwrSoC Applications |
Noah Sturcken
Ferric |
Applications Enabled by Integrated Switched Inductor Power Converters |
Minjie Chen
Princeton |
Extreme Performance 48V-1V Power Delivery for Ultra High Current Microprocessors |
Bob Conner
x-Celeprint |
Heterogeneous Integration Roadmap: Trends in Power Integration for Voltage Regulators and Modules |
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| Poster Session
Session Chair: Minjie Chen Princeton University,
Co-Chairs: Regina Ramos Universidad Politécnica de Madrid (UPM), Yan Lu, University Macau, Ping Wang, Princeton University
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Lucas de Araujo Pereira
CEA, France |
Mathematical Modeling of Piezoelectric DC-DC Converters |
Daniel Zhou
Princeton, U.S.A. |
Intrinsic Voltage Balancing of FCML Converters with Coupled Inductors |
Youssef Elasser
Princeton, U.S.A. |
Vertical Stacked LEGO-PoL CPU Voltage Regulator |
Yenan Chen
Princeton, U.S.A. |
Virtual Intermediate Bus Voltage Regulator for 48 V PoL Applications |
Yao Wang
Drexel, U.S.A. |
Multiphase Interleaved IPT Based DC-DC Converter for High-Current Application |
Carlos Augusto Berlitz
CEA, France |
Low Frequency and Low Power DC-DC Switched Battery Converter |
Dragan Dinulovic
Wurth Elektronik, Germany |
Custom Designed Discrete Microinductors and Microtansformers Fabricated on Silicon for High Frequency Applications |
Ping Wang
Princeton, U.S.A. |
Matrix Coupled All-in-One-Magnetics for PWM Power Conversion |
Tao Zhang
UPENN, U.S.A. |
High winding ratio, high frequency, ultracompact step-up transformers with laminated metallic magnetic cores |
Jun Beom Pyo
UPENN, U.S.A. |
Non-lithographic and scalable fabrication of one-turn like inductor having laminated NiFe core for power converters operating at high frequency |
Diego Serrano López
Princeton, U.S.A. |
MagNet: Data-Driven Methods for Magnetic Core Loss Modeling |
Jef Thoné
MinDCet, Belgium |
Monolithic 200V/10A GaN Powerstage with Integrated Level-shifters and Gate Drivers |
Ayano Furue
Kyushu Institute of Technology, Japan |
Numerical investigations of the multi-layer graphene as a thermal interface material and an elector-magnetic field shield layer for 3D power supply on chip applications |
Kamyar Ahmadi
EnaChip, U.S.A. |
Micro-magnetics with One Mask N-Layer Electroplated Cores |
