PwrSoC 2014 Presentations

Monday, October 6
Plenary Session
Session Chair: Cian O’Mathuna (Tyndall Institute)
08:50 – 09:20 Bruno Allard
Ampere-Lab INSA Lyon
pdf iconState of the art of high switching frequency inductive DC-DC converters in SoC context
09:20 – 09:50 Seth Sanders
UC Berkeley
pdf iconThe Road to Integrated Power Conversion via the Switched Capacitor Approach
09:50 – 10:20 Francesco Carobolante
pdf iconPower Supply on Chip: from R&D to commercial products
Session 1: Systems & Applications
Session Chair: Jim Doyle (Qualcomm), Co-Chair: Francesco Carobolante (Qualcom)
11:05 – 11:30 Dragan Maksimovic
University of Colorado – Boulder
pdf iconIntegration of GaN Supply Modulators and Radio-Frequency Power Amplifiers
11:30 – 11:55 Miguel Rodriguez
pdf iconServer Power Delivery Challenges
11:55 – 12:20 Patrick Mercier
pdf iconEfficient on-chip power conversion for energy harvesting and low-power mobile applications
12:20 – 12:45 Zeynep Deniz
pdf iconA Scalable Distributed Regulator Architecture for the POWER8TM Microprocessor
Session 2: Topologies and Control
Session Chairs: Baoxing Chen (Analog Devices), José Cobos (University Polytechnic of Madrid),
Aleks Prodic (University of Toronto), Eduard Alarcon (University Polytechnic Catalunya)
14:30 – 14:55 David Perreault
pdf iconMiniaturized High-Frequency Integrated Power Conversion for Grid Interface
14:55 – 15:20 Brian Ma
Uni. Of Texas at Dallas
pdf iconVHF Switching Power Converters with 1A/ns Scale Load Current Slew Rate
15:20 – 15:45 S.M. Ahssanuzzaman
Univ. of Toronto
pdf iconHigh Power Density Power Management IC Module with On-Chip Inductors
Session 2 : Topologies and Control (Continued)
16:15 – 16;40 Christophe Vaucourt
Texas Instruments
pdf iconµDC/DC Modules: Fully Integrated DC-DC Converters
16:40 – 17:05 Christoph Sandner
pdf iconTowards a PowerSoC Solution for Automotive Microcontroller Applications
Tuesday, October 7
Session 3: Power Semiconductor Technology

Session Chairs: Don Disney (GLOBAL FOUNDRIES), IL-Yong Park (GLOBAL FOUNDRIES), Wai Tung Ng (University of Toronto)
08:00 – 08:25 Francois Hebert
pdf iconHigh-Frequency Power Management Technologies
08:25 – 08:50 Tomas Palacios
pdf iconSeamless on-wafer integration of GaN and Si devices for the next generation of power management chips
08:50 – 09:15 Sameer Pendharkar
Texas Instruments
pdf iconSilicon and package technology enabling high speed discrete and integrated lateral power devices
09:15 – 09:40 Phil Rutter
pdf iconOptimizing Power MOSFET behavior for high frequency switching in DC-DC conversion
Session 4: Magnetics

Session Chairs: Charles Sullivan (Thayer School of Engineering at Dartmouth), Sarah Bedair (US Army Research Lab)
10:30 – 10:55 Noah Sturcken
Ferric Semiconductor
pdf iconIntegrated Voltage Regulation with Thin-Film Magnetic Core Power Inductors
10:55 – 11:20 Matthias Radecker
pdf iconGalvanic Isolating Power Supplies with Piezoelectric Transformer: From PCB Integration to Chip Integration & from Analogue to Digital Driving
11:20 – 11:45 Gian Piazza
Carnegie Mellon
pdf icon
Thin Film High Frequency Piezoelectric Resonators
11:45 – 12:10 Mete Erturk
Low-loss integrated 3D Solenoid Inductors For Switching Regulators
Session 5: Capacitors for Power Electronics

Session Chairs: Stephen O’Brien (CUNY), Jason Stauth (Thayer School of Engineering at Dartmouth)
14:00 – 14:25 Michael Baker
pdf iconBenefits of Monolithic Stacked‐Wafer Capacitors for High‐Frequency Buck Converters
14:25 – 14:50 Chengrui Le
Columbia University
pdf iconHybrid-Switched-Capacitor-Resonant DC-DC Converter for LED Driver Application
14:50 – 15:15 Mohamed Jatlaoui
pdf iconSilicon integrated capacitance for power conversion applications
15:15 – 15:40 Alex Kalnitsky
pdf iconHigh Density Capacitor for Power Management Applications and its Integration in the SiP
E-Posters Session
Session Chairs: Xing Xing (Analog Devices), Jizheng Qiu (Maxim), Tao Wu (Intel), Seungbum Lim (MIT)
Wednesday, October 8
Session 6: System Integration, Packaging and Manufacturing
Session Chairs: Mike Hayes (Tyndall Institute), Louis Burgyan (LTEC Corporation), Nick Renaud-Bezot (AT&S)
08:00 – 08:25 Jelena Popovic
Delft University of Technology
pdf iconTechnology Platforms & Challenges for 3D GaN Power Converters Packaging
08:25 – 08:50 Nick Renaud-Bezot
pdf iconConsiderations for Embedding Passives and Actives in PCBs
08:50 – 09:15 Steve Ziolkowski
Advanced Semiconductor Engineering (ASE)
pdf iconAn Outsourced Supplier Assembly and Test (OSAT) Perspective on Moving Up the Value Chain
09:15 – 09:40 José Cobos
Technical University of Madrid (UPM)
pdf iconCAD tool to Optimize the Design of a PowerSoC Converter: Powerswipe Design Case
Session 7: Granular Power
Session Chairs: Hanh-Phuc Le (Lion Semiconductor Inc.), Elad Alon (UC Berkeley),
Bruno Allard (Ampere-Lab INSA Lyon), Christoph Sandner (Infineon), Seth Sanders (UC Berkeley)
10:35 – 11:00 Rinkle Jain
pdf iconDistributed Power Conversion – An Answer to Power Delivery Challenges in SoCs?
11:00 – 11:25 Jason Stauth
Thayer School of Engineering at Dartmouth
pdf iconResonant Switched Capacitor Converters for Chip-Scale Power
11:25 – 11:50 Robert Pilawa-Podgurski
University of Illinois Urbana-Champaign
pdf iconScalable series-stacked power delivery architectures for improved efficiency and reduced supply current
11:50 – 12:15 Toke Andersen
ETH-Zurich, IBM
pdf iconDeep trench capacitor based on-chip switched capacitor voltage regulators for microprocessor power delivery
12:15 – 12:40 Hans Meyvaert
KU Leuven
pdf iconMonolithic Capacitive Power Converters Towards Higher Voltage Conversion Ratios