Program Sessions and Chairpersons 2023

A compilation of the presentation abstracts can be downloaded here.

Session Chairperson Affiliation
Plenary Session
Topic Speaker Affiliation
Powering an Intelligent World Soh Yun Siah Technology Vice President, GlobalFoundries, Singapore
Granular Power Supply Xun Liu The Chinese University of Hong Kong, China
Yasser Nour Lotus Microsystems, Denmark
Topic Speaker Affiliation
Current-Shared Multi-Phase FIVRs with Phase-Shedding-Optimized AC Dynamics Hyun-sik Kim School of Electrical Engineering KAIST, South Korea
Integrated Power Electronics for Heterogenous Integration Hanh-Phuc Le University of California San Diego, U.S.
New Architecture for Fully Integrated Granular Power Supplies Santosh Kulkarni Renesas Electronics, U.K.
Modular LDO and EDA Technology for Agile Design Xiaosen Liu Tsinghua University, China
Topologies & Control Yogesh Ramadass Texas Instruments, Santa Clara, U.S.
Yan Lu University of Macau, China
Topic Speaker Affiliation
Finding the Best Topology for the Job: Quantitative Methods for Evaluating Performance of Hybrid Switched-Capacitor DC-DC Converter Topologies Robert Pilawa-Podgurski University of California Berkeley, U.S.
Hybrid DC-DC Converters and the Applications for Processor Power Delivery Wanyuan Qu Zhejiang University, China
Miniaturizing Galvanically Isolated Power Supplies for Integration in Semiconductor Products Tim Merkin Texas Instruments, U.S.
Hybrid Switched Capacitor Converters for 48 V Data-Center Applications Roberto Rizzolatti Infineon, Austria.
Integrated Magnetics Cian O’Mathuna Tyndall National Institute, University College Cork, Ireland
Maeve Duffy University of Galway, Ireland
Marc Wurz University of Hannover, Germany
Topic Speaker Affiliation
High Performance Metal Chip Power Inductor for IVR Toshio Hiraoka Taiyo Yuden, Japan
Manufacturing of Plastic-Based Inductors – A New Approach Sebastian Bengsch Ensinger, Germany
Scalable Integrated Magnetics: A Cost-Effective and Efficient Solution for Vertical Power Trifon Liakopoulos EnaChip, U.S.
Magnetic Material on Silicon for Future Power Inductor Technology Ranajit Sai Tyndall National Institute, Ireland
Wide Band Gap Integration Rinkle Jain Intel, U.S.
Ke-Horng Chen National Yang Ming Chiao Tung University, Taiwan
Topic Speaker Affiliation
GaN Discrete Devices for Portable and Computing Applications Jan Sonsky Innoscience, Belgium
Non-Isolated High Voltage Point-of-Load DC-DC Converters for High Performance Computing Arijit Raychowdhury Georgia Institute of Technology, U.S.
GaN Chip Implementation Platform Hann-Huei Tsai NARLabs, TSRI, Taiwan
GaN-on-Si Process Featuring GaN MOSHEMT Transistor Technology and Integrated Silicon CMOS on 300mm Wafers Han Wui Then Intel, U.S.
Integrated Capacitors and Energy Storage Kousuke Miyaji Shinshu University, Japan
Dina Reda Eldamak German University in Cairo, Egypt
Topic Speaker Affiliation
Improving High Voltage Power Modules with New Silicon Snubber Capacitor Technology Rémy Cannaya Murata, France
CeraCharge™ – World’s First Rechargeable Solid-State SMD Battery Hiroshi Sato TDK, Japan
3D Silicon Capacitor Technology – Versatile Integration Capability for both High Voltage and High Frequency Applications Norman Böttcher Fraunhofer IISB, Germany
Next-Generation Switched-Capacitor Converters using High-Density On-Die MIM Capacitors Nicolas Butzen Intel, U.S.
System Integrated Packaging & Manufacturing Min Chen Innoscience, U.S.
Tina Thomas Fraunhofer IZM, Germany
Topic Speaker Affiliation
Buck PwrSoC Integrated on Magnetic Substrate Laminate Jerry Zhai SG Micro Corp, China
Novel In-Situ Button Shear Methodology for Assessment of the Adhesion Strength of Epoxy Mold Compound in E-mobility Power Module David Guillon Hitachi Energy, Switzerland
Novel and Lightweight 1200V SiC Power Module with Direct-Cooled Substrate Fabio Bernardi Magneti Marelli, Italy
High Frequency Power Conversion for mW and kW Eckart Hoene Fraunhofer IZM, Germany
Systems & Applications José Cobos Technical University of Madrid, Spain
Francesco Carobolante IoTissimo, U.S.
Topic Speaker Affiliation
Miniature High Frequency Auxiliary DC-DC Converter Based on an Improved Thin-Film Microinductor Martin Sittner Würth Elektronik, Germany
Unlocking the Full Potential of Switched-Capacitor Power Conversion: Advanced Switched-Capacitor Integrated Circuits for Next-Generation Applications Pere Llimós Muntal Skycore, Denmark
Challenges for Integration of Power Management Solutions on STM32 µControllers David Chesneau STMicroelectronics, France
Chip-Scale High-Voltage Power Supplies Bernhard Wicht Leibniz University Hannover, Germany
Poster Session Jens Friebe University of Kassel, Germany
Aleksandar Prodic University of Toronto, Canada