The Program Committee will invite 3-4 Plenary talks to illustrate the state of the art, from fundamental research to market, with strong emphasis on technology development
Plenary Session Session Chair: Cian O’Mathuna
Sam Naffziger is a Corporate Fellow at AMD responsible for the company’s technology strategy, and has been the key innovator behind many of AMD’s low power features. He has been in the industry 28 years with a background in microprocessors and circuit design, starting at Hewlett Packard, moving to Intel and then at AMD since 2006. Sam received the BSEE from CalTech in 1988 and MSEE from Stanford in 1993 and holds 115 US patents in processor circuits, architecture and power management. He has authored dozens of publications and presentations in the field and is a Fellow of the IEEE.
Baoxing Chen is an ADI fellow. He joined Analog Devices in 1997 after he graduated from University of Michigan with a Ph. D in Physics and M.S. in EE. Baoxing pioneered the use of micro-transformers for transmitting signal and power through the isolation barrier, which has found broad adoption in many isolation applications with almost 2 billion transformers shipped. He has been leading iCoupler® and isoPower® technology developments at ADI. Baoxing has published over 30 papers and holds 28 US patents.
Dr. Chu is the managing director of FAB2 & FAB5 in TSMC, the world leading semiconductor foundry company. He has over 22 years of professional experience, which spans from process development, operation, and investment management. Dr. Chu holds a Ph.D. in Chemical Engineering from Columbia University. In 2008, he was elected “Manager Excellence Award” in Tainan, Taiwan for his innovations and researches in leading edge technology productions. He is the author & co-author of more than 50 international papers and patents.
Gerald studied organic chemistry and organic technology at the Technical University Vienna. He works as a project leader in the R&D of AT&S. He developed the release layer paste, a major part of the patented 2.5D Technology of AT&S, realized a stripping solution for this technology and lead two projects for the embedding of modules and sensors. He takes part as a team member in other projects of the R&D and provides chemical expertise. He is co-author in 19 filed patent families for PCB applications.