PwrSoC 2016 Presentations

Monday, October 3rd, 2016
Plenary Session
Session Chair: Cian O’Mathuna
9:30 – 9:55 Sam Naffziger
AMD
pdf icon Integrated Power Conversion Strategies across Laptop, Server and Graphics Products
9:55 – 10:20 Baoxing Chen
Analog Devices
pdf icon Air core and magnetic core transformers for isolated power conversion
10:20 – 10:45 P. Chu
TSMC
pdf icon GaN device manufacturing
10:45 – 11:10 Gerald Weidinger
AT&S
pdf icon Close supply chain collaboration enables easy implementation of chip embedded power SiP
Session 1: Systems and Applications
Session Chairs: Francesco Carobolante (Qualcomm), Sami Ajram (SL3J systems)
12:00 – 12:25 Alex Avron
Point the Gap
pdf icon PowerSoC & PowerSiP markets are preparing. Are you?
12:25 – 12:50 Alex Lidow
EPC
pdf icon Application of GaN-on-Silicon Technology in Advanced Power Conversion Systems
12:50 – 13:15 Indumini Ranmuthu
Texas Instruments
pdf icon Challenges of integration of power supplies on chip
13:15 – 13:40 Arnold Knott
Denmark Technical University
pdf icon PwrSoC enabling architectures in different applications
Session 2: Topologies and Control A
Session Chairs: Aleksandar Prodic (U. Toronto), Jason T. Stauth (Darmouth College), Mor Peretz (Ben-Gurion Univ.)
15:30 – 15:55 Jeff Morroni
Texas Instruments
pdf icon Hybrid topologies
15:55 – 16:20 Dusan Graovac
Infineon
pdf icon Embedded power technologies for automotive
16:20 – 16:45 Jason T. Stauth
Dartmouth College
pdf icon Resonant switched-capacitors converters
16:45 – 17:10 Mor Peretz
Ben Gurion University
pdf icon Fully-Integrated Digital Average Current-Mode Control Voltage Regulator Module IC
Tuesday, October 4
Session 3: Power Semiconductor Technologies
Session Chairs: Phil Rutter, Mete Erturk
9:00 – 9:25 Greg Miller
Sarda
pdf icon GaAs for High Frequency Miniaturized DC-DC conversion
9:25- 9:50 Ted Letavic
Global Foundries
pdf icon RF LDMOS for highly integrated solutions
9:50 – 10:15 Mete Erturk
Appulse Power
pdf icon A User’s Perspective of GaN and Si Power Devices for Integrated / Miniaturized Power Management
10:15 – 10:40 Tatsuo Morita
Panasonic
pdf icon Monolithic integration of GaN power transistors integrated with gate drivers
Session 4: Magnetics
Session Chairs: Maeve Duffy (NUI Galway), Charlie Sullivan (Dartmouth College), Ziwei Ouyang (DTU)
11:30 – 11:55 Santosh Kulkarni, Bruno Allard
Tyndall Institute & INSA Lyon
pdf icon Coupled inductors on silicon for PwrSoC in the frame of PowerSwipe project
11:55 – 12:20 Dragan Dinulovic
Würth
pdf icon Microtransformer/Microinductor for Point-of-Load High Frequency DC-DC Converters
12:20-12:55 Antonio Camarda
University of Bologna
pdf icon Design and Fabrication of Bond Wire Micro-magnetics with LTCC core
12:55 – 13:20 Charlie Sullivan
Dartmouth College
pdf icon Geometries and fabrication processes for high-performance nano-granular magnetics on silicon
Session 5: Capacitors and Storage Devices
Session Chairs: Mehdi Jatlaoui (IPDiA), Stephen O’Brien (CUNY)
14:40 – 15:00 Raj Pulugurtha
Georgia Tech
pdf icon Integration of pre-fabricated ultra-high density (1000 nF/mm2) capacitor films (50-75 microns) onto wafers and panels
15:00 – 15:20 Frederic Voiron
IPDiA
pdf icon Advances in trench capacitors for interposer
15:20 – 15:40 Richard Percival, Denis Pasero
ILIKA
pdf icon Energy Harvesting technology challenges
15:40 – 16:00 Nicolas Butzen
KU Leuven
pdf icon Monolithic Switched-Capacitor Power Converters: Present Trends and Future Predictions
Session 6: Topologies and Control B
Session Chairs: Peng Zou (Huawei), Christoph Sandner (Infineon), Luca Corradini (U. Padova)
16:20 – 16:40 Brian Ma
Univ. of Texas at Dallas
pdf icon Driving GaN Power Devices: Design Strategies and Circuit Techniques
16:40 – 17:00 Martin Haug
Wurth
pdf icon Integrated wide-input range converters
17:00 – 17:20 Stefano Saggini
Univ. of Udine
pdf icon Power MOS gating optimization for balancing efficiency vs. reliability in hard-switching converters
17:20 – 17:40 Amit Jain
Intel
pdf icon FIVR Control topology and design for distributed loads
E-Posters Session
Session Chairs: Jesús Oliver, Cristina Fernández, Santosh Kulkarni
18:00 – 20:00 E-Posters Session
Wednesday, October 5, 2016
Session 7: System Integration, Packaging and Manufacturing
Session Chairs:Alex Kalnitsky (TSMC), Noah Sturken (Ferric Semiconductor), Lou Hutter (SVP Dongbu Tech), Mike Hayes (Tyndal Institute)
9:00 – 9:25 CT Wang
TSMC
pdf icon Foundry WLSI technology for Power Management System Integration
9:25 – 9:50 Paul Brohlin
Texas Instruments
pdf icon Electrical and thermal packaging challenges of GaN power devices
9:50 – 10:15 N. Sturcken
Ferric
pdf icon DC-DC Power Conversion with CMOS Integrated Thin-Film Inductors
10:15 – 10:40 Madhavan Swaminathan
Georgia Tech
pdf icon Integrated Voltage Regulators for Digital Applications
Session 8: Granular Power
Session Chairs: Hanh-Phuc Le (U. Colorado), Rinkle Jain (Intel), Sungwoo Moon (Samsung), Gerard Villar-Piqué (NXP), Don Disney (GlobalFoundries)
11:30 – 11:55 Tong Kim
Samsung
pdf icon Mobile SOC PMIC for smartphone platform – from architecture design to development
11:55 – 12:20 Ken Shepard
Columbia Univ.
Integrated voltage regulators based on heterogeneous integration of magnetics and wide-bandgap semiconductors
12:20 – 12:45 Yan Lu
University of Macau
pdf icon Ring-Shaped Multiphase Switched-Capacitor DC-DC Converters with Fast Transient Response and Small Ripple
12:45 – 13:10 Yogesh Ramadash
Texas Instruments
pdf icon Hybrid switching converter architectures for powering processors and SoCs
13:10 – 13:35 Taner Dosluoglu
Endura
Challenges of CPU and GPU domain power delivery and solutions for next generation SoC Applications
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