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PwrPACK Workshop  2019
2019 IEEE PELS/PMSA Phoenix
Workshop on Packaging and Integration in Power Delivery (PwrPack)
 
– An Exploratory Discussion Leading to 2020 PwrSoC
 
Oct. 31- Nov. 1, 2019

Registration and Hotel Reservations are open
Partnership Opportunities still available
Student posters are also solicited.

Location: Skysong Innovation Synergy I, Arizona State University

This Workshop uniquely spotlights technology and manufacturing advancement of miniaturization and integration
of power conversion and power management solutions.

The Power Sources Manufacturers Association (PSMA), in partnership with IEEE Power Electronics Society (PELS), is sponsoring a Phoenix Workshop on Packaging and Integration in Power Delivery at Arizona State University’s SkySong Innovation in Scottsdale, AZ starts 12:00 Noon October 31- and ends at 1:30 PM Nov. 1, 2019 Pacific Time. This two half-day event is An Exploratory Workshop Leading to the 2020 International Workshop on Power Supply on Chip (PwrSoC), in Philadelphia, PA.

In recent years power electronic devices’ overall form factor have scaled-down significantly for a broad range of applications and power levels. This two-half day workshop will focus on two topics related to power delivery in a package:

  1. Power system in package (PSIP) power modules

  2. Process and integration of multi-die power delivery in package,

with invited speakers from both industry and academia to address the challenges and opportunities in miniaturization and efficient power delivery that benefits increasing application areas. Sessions will consist of presentations followed by active discussions between IC designers, assembly experts and substrate/materials providers bringing innovative solutions to address power delivery in package challenges. 

Workshop General Chair Professor Hongbin Yu commenting on this workshop’s venue: “We are excited to have this workshop in Phoenix area, where there are many microelectronics companies in the Valley area that are very active in developing new semiconductor devices that will require innovation in the scaling of power integration and much-improved efficiency. Through this workshop, we hope to foster much stronger collaboration between academia and industry in this region resulting in new and key contributions in power delivery innovations.”

Technical Program Chair Jim Doyle from Dialog Semiconductor points out “The workshop intends to bring together technical experts on SOC packaging mainly from the Phoenix area, the line between pure integration and multichip SIPs have become blurry since processes such as InFo, MCeP,WLP/RCP,WL-esip, 3D TSV offered by different foundries and packaging companies, provide area effective solutions competitive with full integration.  This could revolutionize the decision to integrate or not to integrate. Join us to learn more about the options and trade-offs.”

See the program by world-leading technologists HERE

Take advantage of our  Partnership Opportunity by signing up at the website registration page

Two types of company partnerships are available:

Platinum level provides an exhibit table for the duration of the workshop, two free registrations to all events – plus the Gold-level banner and logo display opportunities.

The Gold level includes company visibility through banner and logo displays shown in workshop events, the technical program and in website and announcement emails. One free registration to all events,

Host    

Sponsored by

         

    Hongbin Yu, yuhb@asu.edu, and  James Doyle Jim.Doyle@diasemi.com

                                     

                                                                   

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