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Friday, November 16 |
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| 09:00-09:25am | Ted DiBene Intel |
Fine Grain On-die Integrated Magnetics; Breaking the Power/Performance Barriers |
| 09:25-09:50am | Jan Rabaey UC Berkeley |
Powering Miniature BioMedical Implants |
| 09:50–10:15am | Steve Grady CYMBET |
Embedding Energy Storage in SoCs using Solid State Batteries |
| 10:15–10:45am | Break | |
| 10:45-11:10am |
Henrik Zessin
Fraunhofer Institute Nuernberg, Germany |
Integrating Power Management architectures for Energy Harvesting |
| 11:10–11:35am | John Camagna Akros Silicon |
Energy Management Concept and Implementation |
| 11:35-12:00pm | Dave Anderson Texas Instruments |
Applications of the PSIP/PwrSoC Products |
| 12:00-01:00pm | Lunch | |
| Session 2: Power Semiconductor Technologies Session Chair: Arnold Alderman Session Co-Chairs: John Shen, Don Disney |
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| 01:00-01:25pm | Il-Yong Park Dongbu HiTek Korea |
High Frequency LDMOS in 0.18µm BCD technology for Power Supply-On-Chip |
| 01:25-01:50pm | Steve Saap Fairchild |
High frequency trench MOSFETs for Power Supply in Package |
| 01:50-02:15pm | Kevin Chen Hong Kong University of Science and Technology |
Device Technologies for Highly Integrated GaN Power Electronics |
| 02:15-02:40pm | Tahir Khan Maxim |
PMU/PMIC Technologies for Multiple Integrated dc-dc converters |
| 02:40-03:10pm | Break | |
| 03:10-03:35pm | Greg Miller Sarda Technologies, Inc. |
Gallium Arsenide (GaAs) Power Stages for Very High Frequency Power Supplies |
| 03:35-04:00pm | Paul Chow RPI (US) |
Comparison of Silicon, GaAs and GaN Technologies for High Switching Speed, Monolithic DC-DC Power Converter ICs |
| Session 3: Magnetics Session Chair: Charlie Sullivan Session Co-Chairs: Ningning Wang, Maeve Duffy, Masahiro Yamaguchi, Satish Prahakaran, Florian Herrault, Sara Bedair |
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| 04:00-04:25pm | Shan X. Wang Stanford University, Palo Alto, CA, USA |
Integrated Transformers with Sputtered Laminated Magnetic Materials |
| 04:25-04:50pm | Mean-Jue Tung Industrial Technology Research Institute of Taiwan(ITRI) |
Low Temperature Co-fired Heterogeneous Ferrite Planar Inductor for High Density Power Applications |
| 04:50-05:15pm | Naigang Wang IBM, TJ Watson Research Center Yorktown Heights |
Magnetics Integration – from Thin Film Heads to on-Chip Inductors |
| 05:15-05:40pm | John Q. Xiao University of Delaware Newark, Delaware, USA |
High frequency and High Power Soft Magnetic Materials for Power Supply Applications |
| 06:00-08:00pm | Opening Reception / Poster Session | |
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Saturday, November 17
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| Session 3: Magnetics (continued) Session Chair: Charlie Sullivan Session Co-Chairs: Ningning Wang, Maeve Duffy, Masahiro Yamaguchi, Satish Prahakaran, Florian Herrault, Sara Bedair |
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| 09:00–09:25am | Florian Herrault Georgia Institute of Technology |
Microfabrication technologies for highly-laminated thick metallic cores and 3-D integrated windings |
| 09:25–09:50am | Robert Mihailovic Teledyne Scientific Co. Thousand Oaks, CA, USA |
Microlaminated Integrated Magnetics for MHz Power Electronics |
| Session 4: Capacitors Session Chair: Magali Brunet Session Co-Chair: Stephen O’Brien |
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| 09:50–10:15am | P. Markondeya Raj Packaging Research Center Georgia Institute of Technology |
Integration of Power-Supply Capacitors with Ultrahigh Density on Silicon Using Particulate Electrodes |
| 10:15–10:40am | Eli Leland City Univeristy of New York |
Metacapacitors: Printed, High-frequency Capacitors for Electric Power Conversion |
| 10:40–11:10am | Break | |
| 11:10–11:35am | Makato Takamiya University of Tokyo, Japan |
3D Stacked Buck Converter with SrTiO3 (STO) Capacitors on Silicon Interposer |
| 11:35–12:00pm | Catherine Bunel IPDIA Caen, France |
High Density Silicon-based Capacitors for Power Electronics System Integration |
| 12:00–12:25pm | Jae-sun Seo IBM, TJ Watson Research Center |
Deep Trench Capacitors for Switch Capacitor Voltage Converters |
| 12:25–01:20pm | Lunch | |
| Session 5: Topologies and Control Session Chair: Yan-Fei Liu Session Co-Chairs: Jose Cobos, Aleksandar Prodic |
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| 01:20–01:45pm | Gerhard Maderbacher, Stefano Marsili, Christoph Sandner Infineon Technologies Austria |
Digital Control Options for Embedded DC-DC Converters in CMOS SoC |
| 01:45-02:10pm | Robert Pilawa University of Illinois Urbana Champaign |
Soft Charging Switched Capacitor CMOS Power Converters – Increasing Efficiency and power Density Using a Merged Two-Stage Architecture |
| 02:10-02:35pm | Rinkle Jain Intel |
Enabling Aggressive Dynamic Voltage and Frequency Scaling in Many Voltage Domains using Distributed Switched Capacitor Voltage Regulators |
| 02:35-03:00pm | Aleksandrar Prodic University of Toronto |
Mixed-Signal IC Controllers and Low Volume SMPS |
| 03:00-03:30pm | Break/Poster Session | |
| 03:30-03:55pm | David J. Perreault, Antohny Sagneri MIT / OnChip Power |
Design of Miniaturized, Isolated dc-dc Cnoverters Operating at Radio Frequencies |
| 03:55-04:20pm | Yogesh Ramadass Texas Instruments |
A 330nA Charger and Battery Management IC for Solar and Thermoelectric Energy Harvesting |
| Session 6: Converter: Granular Power Management for SoC Session Chair: Elad Alon Session Co-Chairs: Christoph Sandner, Bruno Allard, Eduard Alarcon, Hanh-Phuc Le |
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| 04:20-04:45pm | Mondira (Mandy) Pant Intel |
The Era of Intelligent Power Delivery |
| 04:45-05:10pm | Hans Meyvaert K. U. Leuven |
Fully Integrated Switched-Capacitor DC-DC: Bulk CMOS Oriented Design |
| 05:10-05:35pm | Ken Shepard Columbia University |
Scalable integrated voltage regulation technologies |
| 06:00-07:00pm 07:00-08:00pm |
Open Forum Discussion Post Forum Discussion |
Granular Power Application and Technology: Inductor-Based vs. Switched-Capacitor vs. Linear |
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Sunday, November 18
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| Session 6: Converter: Granular Power Management for SoC (Continued) Session Chair: Elad Alon Session Co-Chairs: Christoph Sandner, Bruno Allard, Eduard Alarcon, Hanh-Phuc Le |
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| 08:00-08:25am | Stephen Kosonocky AMD |
Power Delivery Challenges for Next Generation High Performance SOCs |
| 08:25-08:55am | Gu-Yeon Wei Harvard University |
Fine-Grain Power Management in Multi-Core SoCs using Integrated Voltage Regulators |
| 08:55-09:20am | Gerard Villar Piqué NXP |
Potential Benefits of Integrated Switching Power Converters: Inductive vs. switched-Capacitor |
| 09:20-09:45am | Toke Meyer Andersen Florian Krismer Johann W. Kolar ETH Zurich Zurich, Switzerland Thomas Toifl IBM Research Zurich, Rüschlikon, Switzerland |
High Power Density On-Chip Switched Capacitor Converters for Microprocessor Power Delivery |
| 09:45-10:15am | Break | |
| Session 7: System Integration, Packaging and Manufacturing Session Chair: Matthew Wilkowski Session Co-Chairs: Baoxing Chen, Doug Hopkins, Trifon Liakopoulos |
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| 10:15–10:40am | Neil Robertson HGST Research a Western Digital Company |
Material Options and Manufacturing Processes for Electroplating Magnetic Materials |
| 10:40–11:05am | Toshiro Sato, Makoto Sonehara, Hiroki Kobayashi,Fumihiro Sato and Kazuhiro Hagita Spin Device Technology Center Shinshu University Rie Takeda and Nobuhiro Matsushita Materials and Structures Laboratory Tokyo Institute of Technology Tomohiro Fujii, Shinji Nakazawa, Hiroshi Shimizu and Kazutaka Kobayashi Shinko Electric Industries Co. Ltd. Yasuhiro Shinozuka, Yuji Fuketa, Makoto Takamiya and Takayasu Sakurai Institute of Industrial Science University of Tokyo |
Magnetic core power inductor embedded in plastic interposer toward power supply integrated in LSI Package |
| 11:05–11:30am | Alex Kalnitsky, Y.W. Tseng, T.H. Chien, C.Y. Chang and Felix Tsui TSMC Analog/RF & Specialty Technology Division |
1 milli Ohm/square Bondable Post-Passivation Interconnect for Power Management Technologies |
| 11:30–11:55am | Jason Kulick and Gary H. Bernstein Indiana Integrated Circuit Olivier Trescases University of Toronto |
Quilt Packaging interconnect technology enables better than monolithic performance |
| 11:55–12:20pm | Xing Xing Boaxing Chen ADI Nian X. Sun Northeastern University |
High Bandwidth Low Insertion Loss Solenoid Transformers Using FeCoB Multilayers |
| 12:20–12:45pm | Trifon Liakopoulos, Amrit Panda, Ashraf Lotfi and Matt Wilkowski Enpirion |
Manufacturing Development of a New Electroplated Magnetic Alloy Enabling Commercializatin of PwrSoC Products |
| 12:45–01:00pm | Close of Workshop | |
| 01:00–02:00pm | Lunch | |
