Monday, October 3rd, 2016
Plenary Session Session Chair: Cian O'Mathuna
9:30 – 9:55	Sam Naffziger AMD	Integrated Power Conversion Strategies across Laptop, Server and Graphics Products
9:55 – 10:20	Baoxing Chen Analog Devices	Air core and magnetic core transformers for isolated power conversion
10:20 – 10:45	P. Chu TSMC	GaN device manufacturing
10:45 – 11:10	Gerald Weidinger AT&S	Close supply chain collaboration enables easy implementation of chip embedded power SiP
Session 1: Systems and Applications Session Chairs: Francesco Carobolante (Qualcomm), Sami Ajram (SL3J systems)
12:00 – 12:25	Alex Avron Point the Gap	PowerSoC & PowerSiP markets are preparing. Are you?
12:25 – 12:50	Alex Lidow EPC	Application of GaN-on-Silicon Technology in Advanced Power Conversion Systems
12:50 – 13:15	Indumini Ranmuthu Texas Instruments	Challenges of integration of power supplies on chip
13:15 – 13:40	Arnold Knott Denmark Technical University	PwrSoC enabling architectures in different applications
Session 2: Topologies and Control A Session Chairs: Aleksandar Prodic (U. Toronto), Jason T. Stauth (Darmouth College), Mor Peretz (Ben-Gurion Univ.)
15:30 – 15:55	Jeff Morroni Texas Instruments	Hybrid topologies
15:55 – 16:20	Dusan Graovac Infineon	Embedded power technologies for automotive
16:20 – 16:45	Jason T. Stauth Dartmouth College	Resonant switched-capacitors converters
16:45 – 17:10	Mor Peretz Ben Gurion University	Fully-Integrated Digital Average Current-Mode Control Voltage Regulator Module IC
Tuesday, October 4
Session 3: Power Semiconductor Technologies Session Chairs: Phil Rutter, Mete Erturk
9:00 – 9:25	Greg Miller Sarda	GaAs for High Frequency Miniaturized DC-DC conversion
9:25- 9:50	Ted Letavic Global Foundries	RF LDMOS for highly integrated solutions
9:50 – 10:15	Mete Erturk Appulse Power	A User's Perspective of GaN and Si Power Devices for Integrated / Miniaturized Power Management
10:15 – 10:40	Tatsuo Morita Panasonic	Monolithic integration of GaN power transistors integrated with gate drivers
Session 4: Magnetics Session Chairs: Maeve Duffy (NUI Galway), Charlie Sullivan (Dartmouth College), Ziwei Ouyang (DTU)
11:30 – 11:55	Santosh Kulkarni, Bruno Allard Tyndall Institute & INSA Lyon	Coupled inductors on silicon for PwrSoC in the frame of PowerSwipe project
11:55 – 12:20	Dragan Dinulovic Würth	Microtransformer/Microinductor for Point-of-Load High Frequency DC-DC Converters
12:20-12:55	Antonio Camarda University of Bologna	Design and Fabrication of Bond Wire Micro-magnetics with LTCC core
12:55 – 13:20	Charlie Sullivan Dartmouth College	Geometries and fabrication processes for high-performance nano-granular magnetics on silicon
Session 5: Capacitors and Storage Devices Session Chairs: Mehdi Jatlaoui (IPDiA), Stephen O'Brien (CUNY)
14:40 – 15:00	Raj Pulugurtha Georgia Tech	Integration of pre-fabricated ultra-high density (1000 nF/mm2) capacitor films (50-75 microns) onto wafers and panels
15:00 – 15:20	Frederic Voiron IPDiA	Advances in trench capacitors for interposer
15:20 – 15:40	Richard Percival, Denis Pasero ILIKA	Energy Harvesting technology challenges
15:40 – 16:00	Nicolas Butzen KU Leuven	Monolithic Switched-Capacitor Power Converters: Present Trends and Future Predictions
Session 6: Topologies and Control B Session Chairs: Peng Zou (Huawei), Christoph Sandner (Infineon), Luca Corradini (U. Padova)
16:20 – 16:40	Brian Ma Univ. of Texas at Dallas	Driving GaN Power Devices: Design Strategies and Circuit Techniques
16:40 – 17:00	Martin Haug Wurth	Integrated wide-input range converters
17:00 – 17:20	Stefano Saggini Univ. of Udine	Power MOS gating optimization for balancing efficiency vs. reliability in hard-switching converters
17:20 – 17:40	Amit Jain Intel	FIVR Control topology and design for distributed loads
E-Posters Session Session Chairs: Jesús Oliver, Cristina Fernández, Santosh Kulkarni
18:00 – 20:00	E-Posters Session
Wednesday, October 5, 2016
Session 7: System Integration, Packaging and Manufacturing Session Chairs:Alex Kalnitsky (TSMC), Noah Sturken (Ferric Semiconductor), Lou Hutter (SVP Dongbu Tech), Mike Hayes (Tyndal Institute)
9:00 – 9:25	CT Wang TSMC	Foundry WLSI technology for Power Management System Integration
9:25 – 9:50	Paul Brohlin Texas Instruments	Electrical and thermal packaging challenges of GaN power devices
9:50 – 10:15	N. Sturcken Ferric	DC-DC Power Conversion with CMOS Integrated Thin-Film Inductors
10:15 – 10:40	Madhavan Swaminathan Georgia Tech	Integrated Voltage Regulators for Digital Applications
Session 8: Granular Power Session Chairs: Hanh-Phuc Le (U. Colorado), Rinkle Jain (Intel), Sungwoo Moon (Samsung), Gerard Villar-Piqué (NXP), Don Disney (GlobalFoundries)
11:30 – 11:55	Tong Kim Samsung	Mobile SOC PMIC for smartphone platform – from architecture design to development
11:55 – 12:20	Ken Shepard Columbia Univ.	Integrated voltage regulators based on heterogeneous integration of magnetics and wide-bandgap semiconductors
12:20 – 12:45	Yan Lu University of Macau	Ring-Shaped Multiphase Switched-Capacitor DC-DC Converters with Fast Transient Response and Small Ripple
12:45 – 13:10	Yogesh Ramadash Texas Instruments	Hybrid switching converter architectures for powering processors and SoCs
13:10 – 13:35	Taner Dosluoglu Endura	Challenges of CPU and GPU domain power delivery and solutions for next generation SoC Applications