Poster Chair: Prof. Chia-Ling Wei, National Cheng Kung University
Co-Chair: Prof. Ningning Wang, School of Electronics and Information, Hangzhou Dianzi University
Those presentations not available are so indicated.
Category |
First Author Name |
Affiliation |
Poster Title |
| Emerging Technologies | David Romain | University of Lyon, France | Study and Design of an Integrated VCSEL Driver (150MHz, 1W) for an iToF 3D-based CMOS Image Sensor |
| Emerging Technologies | Kathlerine A. Kim | Ulsan National Institute of Science and Technology m(UNIST), Korea | Parallel Differential Power Processing Converter Approach for Photovoltaic-Powered Wearable Applications (Poster not available) |
| Granular Power Supply | Francesco Cannillo | Dialog Semiconductor, Germany | Scalable System-level Approach for SoC Supply |
| Granular Power Supply | Barry Clarke | TEL Magnetic Solutions Ltd, Ireland | Optimization of Magnetic Properties for Single Layer and Laminated Cores of Cobalt Rich Amorphous Films Resulting from Post Deposition Magnetic Annealing |
| Granular Power Supply | Dragan Dinulovic | Würth Elektronik eiSos GmbH & Co. KG, Germany | PSiP Power Micromodules with Integrated Inductor for Point-of-Load Applications |
| Granular Power Supply | Toru Sai | University of Tokyo, Japan | Spike Noise Cancelling Circuit for Switched Capacitor DC-DC Converter Mounting MLCCs on CMOS Die |
| Integrated Capacitive Devices | Mohamed Mehdi Jatlaoui | MuRata Integrated Passive Solutions, France | Thin Deep Trench Capacitors Stacking Process towards High density Low ESR/ESL passive devices (Poster not available) |
| Integrate Magnetics | Seiya Abe | Kyushu Institute of Technology, Japan | Design Consideration of Air-Core On-Chip Spiral Coil for Power-SoC |
| Integrate Magnetics | Seamus O’Driscoll | Tyndall Institute, Ireland | Electrical Characterisation of Thin Film CZTB Solenoid Inductor in 5V CMOS PwrSiP |
| Integrate Magnetics | Claudiu V. Falub | Evatec AG, Switzerland | Innovations in Deposition of Soft Magnetic Thin Films with Tunable Properties for Integrated Power Converters and RF Components |
| Integrate Magnetics | Takeshi Hara | RICOH Electronic Devices Co., Ltd., Japan | A Planar Inductor Technology by Spray-coat Method for the Power Supply for Compact IoT Sensor Node (Poster not available) |
| Integrate Magnetics | Matthias Landmann | Singulus Technologies AG, Germany | PVD Production of Soft Magnetic Multilayers for Integrated Magnetic Inductors (Poster not available) |
| Integrate Magnetics | Yuki Sato | Texas Instruments, U.S.A. | A SPICE Model of Inductors Considering Hysteresis Properties |
| Integrate Magnetics | Rongxiang Wu | State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu, Peoples Republic of China | On-Chip Transformers with Capacitive Shielding Structures for High dV/dt Signal Isolation (Poster not available) |
| System Integration | Michael Brooks | Würth Elektronik eiSos GmbH & Co. KG, Germany | Thermal Advantages of Overmolding Power System in Package (PSiP) Modules |
| System Integration | Yoshiki Sato | Kyushu Institute of Technology, Japan | Numerical Predictions of a Novel 3D stacked Power-SoC Structure Based on Hexagonal-BN |
| System Integration | Jia WANG | Northwestern Polytechnical University, Peoples Republic of China | An Efficient Methodology of Building Power SoC |
| Systems and Application | Ahmed Ammar | Technical University of Denmark | Miniaturization of LED Drivers |
| Systems and Application | Kuo-Chi (Kevin) Liu | Richtek Technology Corporation, Taiwan | Dynamic Impedance Matching Control for Wireless Power Charging Systems (Poster not available) |
| Systems and Application | Fangyu Mao | University of Macau, People’s Republic of China | A Reconfigurable Cross-Connected Wireless-Power Transceiver for Bidirectional Device-to-Device Charging |
| Topologies and Control | Le-Ren Chang-Chien | National Cheng Kung University, Taiwan | Pipeline Control Sharing Technique for Voltage Regulators within Power Management Unit (Poster not available) |
| Topologies and Control | Zhiping Dong | School of Electrical Engineering, Chongqing University, People’s Republic of China | The Modulation and Control Strategy of DC-link Current Minimization for Single-Phase Current Source Inverter (Poster not available) |
| Topologies and Control | Sita Asar | The Ohio State University, U.S.A. | Dual-Frequency SIMO Topologies for On-Chip Dynamic Power Supplies |
| Topologies and Control | Etienne Foray | Université de Lyon, France | Topology Exploration for High-voltage Low Power Dc-Dc Converter |
| Topologies and Control | Jens Christian Hertel | Technical University of Denmark | Using Time-Based Control Techniques for Active Rectification |
| Topologies and Control | Kyoungho Lee | Korea Electrotechnology Research Institute | A Switch-only Rectifier with Switch Off-time Control for Piezoelectric Energy Harvester |
| Topologies and Control | Yiru Miao | Chongqing University, People’s Republic of China | Sliding Control Strategy for Start-up and Steady State of Boost Converter (Poster not available) |
| Topologies and Control | Toshiomi Oka | Kyushu Institute of Technology, Japan | Transient Response of a Digitally Controlled Power Supply Based on Power-SoC |
| Topologies and Control | Sheng-Hsiang (Joe) Pan | National Taiwan University, Taiwan | A Monolithic Capacitor Current Constant On-Time Controlled Buck Converter Achieving Near Optimal Response without Stability Trade-off |
| Topologies and Control | Frederik Spliid | Technical University of Denmark | Stacked Class E resonant Very High Frequency Converter for European Mains Power Factor Correction (Poster not available) |
| Wide Band Gap | Arvind Sridhar | IBM Research Zurich, Switzerland | GaNonCMOS: GaN Power Switches Integrated with Si-CMOS for Reliable Power Delivery Systems (Poster not available) |
