A downloadable version of the program can be found here.
A compilation of the presentation abstracts can be downloaded here.
|
|
Wednesday, September 27th | ||
|---|---|---|---|
| Session | Chairperson | ||
| Plenary Session | |||
| Time | Topic | ||
| 8:00 AM | Welcome Coffee | ||
| 9:30 AM | Opening Ceremony
Bernhard Wicht, General Chair of PwrSoC 2023, Germany Bruno Allard, Technical Program Committee Chair, France |
||
| 9:50 AM | Welcoming Holger Blume Vice President for Research and Transfer, Leibniz University Hannover, Germany |
||
| 10:00 AM | Powering an Intelligent World Soh Yun Siah Technology Vice President, GlobalFoundries, Singapore |
||
| 10:45 AM | Break | ||
| Session | Chairperson | ||
| Granular Power Supply | Xun Liu The Chinese University of Hong Kong, China |
||
| Yasser Nour Lotus Microsystems, Denmark |
|||
| Time | Topic | ||
| 11:20 AM | Current-Shared Multi-Phase FIVRs with
Phase-Shedding-Optimized AC Dynamics Hyun-sik Kim School of Electrical Engineering KAIST, South Korea |
||
| 11:45 AM | Integrated Power Electronics for Heterogenous Integration Hanh-Phuc Le University of California San Diego, U.S. |
||
| 12:15 PM | Lunch | ||
| 1:30 PM | New Architecture for Fully Integrated Granular Power Supplies Santosh Kulkarni Renesas Electronics, U.K. |
||
| 1:55 PM | Modular LDO and EDA Technology for Agile Design Xiaosen Liu Tsinghua University, China |
||
| Session | Chairperson | ||
| Topology & Control | Yogesh Ramadass Texas Instruments, U.S |
||
| Yan Lu University of Macau, China |
|||
| Time | Topic | ||
| 2:20 PM | Finding the Best Topology for the Job: Quantitative Methods for Evaluating
Performance of Hybrid Switched-Capacitor DC-DC Converter Topologies
Robert Pilawa-Podgurski University of California Berkeley, U.S. |
||
| 2:45 PM | Hybrid DC-DC Converters and the Applications for Processor Power Delivery
Wanyuan Qu Zhejiang University, China |
||
| 3:10 PM | Coffee Break and Group Photo | ||
| 3:40 PM | Miniaturizing Galvanically Isolated Power Supplies for Integration in Semiconductor Products
Tim Merkin Texas Instruments, U.S. |
||
| 4:05 PM | Hybrid Switched Capacitor Converters for 48 V Data-Center Applications
Roberto Rizzolatti Infineon, Austria |
||
| 4:30 PM | End of Talks | ||
| 5:00 PM | Poster Session | ||
| 6:30 PM | Welcome Reception | ||
|
|
Thursday, September 28th | ||
| Session | Chairperson | ||
| Integrated Magnetics | Cian O’Mathuna Tyndall National Institute, University College Cork, Ireland |
||
| Maeve Duffy University of Galway, Ireland |
|||
| Marc Wurz Leibniz University Hannover, Germany |
|||
| Time | Topic | ||
| 9:00 AM | High Performance Metal Chip Power Inductor for IVR
Toshio Hiraoka Taiyo Yuden, Japan |
||
| 9:25 AM | Manufacturing of Plastic-Based Inductors – A New Approach
Sebastian Bengsch Ensinger, Germany |
||
| 9:50 AM | Scalable Integrated Magnetics: A Cost-Effective and Efficient Solution for Vertical Power
Trifon Liakopoulos EnaChip, U.S. |
||
| 10:15 AM | Magnetic Material on Silicon for Future Power Inductor Technology
Ranajit Sai Tyndall National Institute, Ireland |
||
| 10:40 AM | Break | ||
| Session | Chairperson | ||
| Wide Band Gap Integration | Rinkle Jain Intel, U.S. |
||
| Ke-Horng Chen National Yang Ming Chiao Tung University, Taiwan |
|||
| Time | Topic | ||
| 11:20 AM | GaN Discrete Devices for Portable and Computing Applications
Jan Sonsky Innoscience, Belgium |
||
| 11:45 AM | Non-Isolated High Voltage Point-of-Load DC-DC Converters for High Performance Computing
Arijit Raychowdhury Georgia Institute of Technology, U.S. |
||
| 12:15 PM | Lunch | ||
| 1:30 PM | GaN Chip Implementation Platform
Hann-Huei Tsai NARLabs, Taiwan Semiconductor Research Institute, Taiwan |
||
| 1:55 PM | GaN-on-Si Process Featuring GaN MOSHEMT Transistor Technology and Integrated Silicon CMOS on 300mm Wafers
Han Wui Then Intel, U.S. |
||
| Session | Chairperson | ||
| Integrated Capacitors and Energy Storage | Kousuke Miyaji Shinshu University, Japan |
||
| Dina Reda Eldamak German University in Cairo, Egypt |
|||
| Time | Topic | ||
| 2:20 PM | Improving High Voltage Power Modules with New Silicon Snubber Capacitor Technology
Rémy Cannaya Murata, France |
||
| 2:45 PM | CeraCharge™ – World’s First Rechargeable Solid-State SMD Battery
Hiroshi Sato TDK, Japan |
||
| 3:15 PM | Poster Session | ||
| 4:45 PM | 3D Silicon Capacitor Technology – Versatile Integration Capability for both High Voltage and High Frequency Applications
Norman Böttcher Fraunhofer IISB, Germany |
||
| 5:10 PM | Next-Generation Switched-Capacitor Converters using High-Density On-Die MIM Capacitors
Nicolas Butzen Intel, U.S. |
||
| 5:35 PM | End of Talks | ||
| 7:00 PM | Gala Dinner with Poster Award | ||
|
|
Friday, September 29th | ||
| Session | Chairperson | ||
| System Integrated Packaging & Manufacturing | Min Chen Innoscience, U.S. |
||
| Tina Thomas Fraunhofer IZM, Germany |
|||
| Time | Topic | ||
| 8:30 AM | Buck PwrSoC Integrated on Magnetic Substrate Laminate
Jerry Zhai SG Micro Corp, China |
||
| 8:55 AM | Novel In-Situ Button Shear Methodology for Assessment of the Adhesion Strength of Epoxy Mold Compound in E-mobility Power Module
David Guillon Hitachi Energy, Switzerland |
||
| 9:20 AM | Novel and Lightweight 1200V SiC Power Module with Direct-Cooled Substrate
Fabio Bernardi Magneti Marelli, Italy |
||
| 9:45 AM | High Frequency Power Conversion for mW and kW
Eckart Hoene Fraunhofer IZM, Germany |
||
| 10:10 AM | Break | ||
| Session | Chairperson | ||
| Systems & Applications | José Cobos Technical University of Madrid, Spain |
||
| Francesco Carobolante IoTissimo, U.S. |
|||
| Time | Topic | ||
| 10:40 AM | Miniature High Frequency Auxiliary DC-DC Converter Based on an Improved Thin-Film Microinductor
Martin Sittner Würth Elektronik, Germany |
||
| 11:05 AM | Unlocking the Full Potential of Switched-Capacitor Power Conversion: Advanced Switched-Capacitor Integrated Circuits for Next-Generation Applications
Pere Llimós Muntal Skycore, Denmark |
||
| 11:30 AM | Challenges for Integration of Power Management Solutions on STM32 µControllers
David Chesneau STMicroelectronics, France |
||
| 11:55 AM | Chip-Scale High-Voltage Power Supplies
Bernhard Wicht Leibniz University Hannover, Germany |
||
| 12:20 PM | End of Talks and Lunch | ||
| 1:30 PM | Technical Tour
Baker Hughes, Germany |
||
| 5:30 PM- 6:00 PM |
End of Technical Tour (Back at Leibniz University) | ||
