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–
|
Plenary Session |
|
|
|
Topic |
Speaker |
Affiliation |
|
|
Soh Yun Siah |
Technology Vice President, GlobalFoundries, U.S./Singapore |
|
+
|
Granular Power Supply |
Xun Liu |
The Chinese University of Hong Kong, China |
|
|
|
Yasser Nour |
Lotus, Denmark |
|
Topic |
Speaker |
Affiliation |
|
Current-Shared Multi-Phase FIVRs with Phase-Shedding-Optimized AC Dynamics |
Hyun-sik kim |
School of Electrical Engineering KAIST, Korea |
|
|
Hanh-Phuc Lee |
University of California San Diego, U.S. |
|
|
Santosh Kulkarni |
Renesas Electronics, U.K. |
|
Modular LDO and EDA Technology for Agile Design |
Xiaosen Liu |
Tsinghua University, China |
|
+
|
Topologies & Control |
Yogesh Ramadass |
Texas Instruments, Santa Clara, USA |
|
|
|
Yan Lu |
University of Macau, China |
|
Topic |
Speaker |
Affiliation |
|
|
Robert Pilawa-Podgurski |
University of California Berkeley, U.S. |
|
Hybrid DC-DC Converters for Microprocessors |
Wanyuan Qu |
Zhejiang University, China |
|
Higher Power Density DC-DC Converters through Energy-Dense Passives utilizing Emerging Topologies |
Orlando Lazaro |
Texas Instruments, U.S. |
|
+
|
Integrated Magnetics |
Cian O’Mathuna |
Tyndall National Institute, University College Cork, Ireland |
|
|
|
Maeve Duffy |
University of Galway, Ireland |
|
|
|
Marc Wurz |
University of Hannover, Germany |
|
Topic |
Speaker |
Affiliation |
|
Magnetic Material on Silicon |
Ranajit Sai |
Tyndall National Institute, Ireland |
|
Plastic-Based Inductors |
Sebastian Bengsch |
Ensinger, Germany |
|
|
Matt Wilkowski / Trifon Liakopoulos |
EnaChip, U.S. |
|
|
Yoshibumi Matsuda |
Taiyo Yuden, Japan |
|
+
|
Wide Band Gap Integration |
Rinkle Jain |
Intel, USA |
|
|
|
Ke-Horng Chen |
National Yang Ming Chiao Tung University, Taiwan |
|
Topic |
Speaker |
Affiliation |
|
|
Jan Sonsky |
Innoscience, Belgium |
|
GaN-on-Si Process |
Han Wui Then |
Intel, U.S. |
|
+
|
Integrated Capacitors and Energy Storage |
Kousuke Miyaji |
Shinshu University, Japan |
|
|
|
Dina Reda Eldamak |
German University in Cairo, Egypt |
|
Topic |
Speaker |
Affiliation |
|
Solid-State Battery |
Hiroshi Sato |
TDK, Japan |
|
High Voltage Silicon 3D Capacitors |
Norman Böttcher |
Fraunhofer IISB, Germany |
|
3D Trench Silicon Capacitors |
Mohamed Mehdi Jatlaoui |
Murata, France |
|
+
|
System Integrated Packaging & Manufacturing |
Min Chen |
Innoscience, USA |
|
|
|
Tina Thomas |
Fraunhofer IZM, Germany |
|
Topic |
Speaker |
Affiliation |
|
Buck PwrSoc on Magnetic Substrate Laminate |
Jerry Zha |
Grenotek Technology, China |
|
Novel In-Situ Button Shear Methodology for Assessment of the Adhesion Strength of Epoxy Mold Compound in E-mobility Power Module |
David Guillon |
Hitachi Energy, Switzerland |
|
Novel and Lightweight 1200V SiC Power Module with Direct-Cooled Substrate |
Fabio Bernardi |
Magneti Marelli, Italy |
|
High Frequency Power Conversion for mW and kW |
Eckart Hoene |
Fraunhofer IZM, Germany |
|
+
|
Systems & Applications |
Jose Cobos |
Technical University of Madrid, Spain |
|
|
|
Francesco Carobolante |
IoTissimo, USA |
|
Topic |
Speaker |
Affiliation |
|
Wireless Power Transfer at 13.6MHz |
|
NXP, Netherlands |
|
Switched-Capacitor Converters |
|
Skycore, Denmark |
|
Embedded Power Management Solutions on STM32 µControlers |
David Chesneau |
STMicroelectronics, France |
|
Poster Session |
Jens Friebe |
University of Kassel, Germany |
|
|
|
Aleksandar Prodic |
University of Toronto, Canada |
