e-poster NO. |
Author |
Affiliation |
ePoster Title |
1 |
Dr. Hongbin Yu |
Arizona State University |
Optimization of soft magnetic thin films structures in on-chip inductors for efficient power conversion in integrated voltage regulators |
2 |
Gaël Pillonnet |
Univ. Grenoble Alpes |
Topology Comparison between Inductor, Capacitor and Resonant-based Fully Integrated DC-DC Converter in CMOS 65nm |
3 |
Julià Delos |
Philips Research Netherlands |
Resource/performance optimization of hybrid inductive-capacitive converters |
4 |
Jef Thoné |
MinDCet |
Large-signal inductor loss measurement on integrated inductors |
5 |
Yue Wen, Oliver Trescases |
University of Toronto |
A Power Management IC with Bi-Directional Current-Mode Control and Partial Power Processing for Concentrating PV Systems |
6 |
Toke Meyer Andersen |
Swiss Federal University of Technology |
CarrICool: Interposer supporting optical signaling, liquid cooling, and power conversion for 3D chip stacks |
7 |
Yen Mai Nguyen |
Université de Toulouse UPS |
Modeling and design optimization of micro-inductor using genetic algorithm |
8 |
Christopher Schaef |
Thayer School of Engineering at Dartmouth |
HIGH EFFICIENCY POWER CONVERSION FOR DIGITAL CIRCUITS THROUGH STACKED VOLTAGE DOMAINS |
9 |
Florian Neveu |
University of Lyon |
Power stage design and optimization for low power, high frequency, integrated DC-DC converter |
10 |
Kapil Kesarwani |
Thayer School of Engineering at Dartmouth |
HIGH-DENSITY HIGH EFFICIENCY RESONANT SWITCHED CAPACITOR CONVERTER FOR CHIP SCALE POWER CONVERSION |
11 |
Takuto Hashiguchi |
Kyushu Institute of Technology |
A Novel Multi-output Back-Boost POL Architecture for Power Supply on Chip |
12 |
Thomas Souvignet |
University
of Lyon |
8-phase interleaved SC DC/DC converter with a frequency control-loop |
13 |
Dimitris Niarchos |
Institute of Nanoscience and Nanotechnology, NCSR ‘Demokritos’ |
FeBSi-based multilayered thin films for HF applications |
14 |
Gerhard Maderbacher |
Infineon Technologies AG |
High Efficient Power Conversion from Car Batteries to Next Generation Microcontroller Systems |
15 |
Hengchun Mao |
Powerest LLC |
High-Frequency Power Integration to Enable Spatial-Freedom Wireless Power Transfer at 6.78MHz |
16 |
Alberto Puggelli |
UC Berkeley |
Fully-Integrated Switched-Capacitor DCDC Converter with Single-Phase Operation Co-Integrated with a RISC-V Processor in 28nm FDSOI |
17 |
Wataru Yoshida |
Kyushu Institute of Technology |
Numerical evaluations of a new 3D stacking structure for power supply on chip |
18 (Invited) |
Masahiro Yamaguchi |
Tohoku University |
Fe-system magnetic flake composite planar inductor integrated for a SiP DC-to-DC converter |
19 |
Baoxing Chen |
Analog Devices Inc. |
Large Signal Modeling and Characterization of Integrated and Isolated Power Transformers with Magnetic Core |
20 |
Dibyajat Mishra |
Georgia Institute of Technology |
Multilayered ferromagnetic-polymer composite structures for integrated, high-density power supply inductors |
21 |
Dragan Dinulovic |
Würth Elektronik |
Integrated Microtransformer on Silicon for High Frequency Power Applications |
22 |
Mohammad Araghchini |
Massachusetts Institute of Technology |
Modeling, Fabrication and Characterization of MEMS Toroidal Inductors for Integrated Power Electronics |
23 |
Yutian Lei |
The University of Illinois at Urbana-Champaign |
Optimization of Soft-Charging Switched-Capacitor Converters |
24 |
Seiya Abe |
The International Centre for the Study of East Asian Development |
Isolated Power Transfer System for Power Supply on Chip |
25 |
Shandong Li |
Qingdao University |
Self-bias ferromagnetic resonance and quasi magnetic isotropy of [FeCo-B/MgO]6multilayers prepared by composition gradient sputtering |
26 |
Steve Grady |
Cymbet Corporation |
Power Innovations for SoCs using Integrated Solid State Rechargeable Batteries |
27 |
Ulrike Wallrabe |
University of Freiburg |
3D microtransformers for 1-300 MHz chip-level power conversion |
28 |
Xiaomin Li |
North Carolina State University |
An Integrated High Efficiency Ultra—low Power DC/AC Inverter for Liquid Crystal Driving in Electro—optic Diffractive Lenses |
29 |
Zhenxian Liang |
Oak Ridge National Laboratory |
Packaging Technology for Multi-functional Integration of Advanced SiC Power Modules |
30 |
Christopher Meyer |
US Army Research Lab |
Integrated Components for Chip Scale Power Management |
31 |
Ningning Wang; Cian O’mathuna |
Tyndall National Institute |
Development of High Efficiency Integrated Micro-transformers on Silicon for Power & Signal Isolation |
32 |
Nian Sun |
Northeastern University |
Integrated Magnetics and Multiferroics for Compact and Power Efficient Sensing, Memory, Power, RF, Microwave Electronics |