| Monday, October 3rd, 2016 | ||
|---|---|---|
| Plenary Session Session Chair: Cian O’Mathuna |
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| 9:30 – 9:55 | Sam Naffziger AMD |
 Integrated Power Conversion Strategies across Laptop, Server and Graphics Products |
| 9:55 – 10:20 | Baoxing Chen Analog Devices |
Air core and magnetic core transformers for isolated power conversion |
| 10:20 – 10:45 | P. Chu TSMC |
GaN device manufacturing |
| 10:45 – 11:10 | Gerald Weidinger AT&S |
Close supply chain collaboration enables easy implementation of chip embedded power SiP |
| Session 1: Systems and Applications Session Chairs: Francesco Carobolante (Qualcomm), Sami Ajram (SL3J systems) |
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| 12:00 – 12:25 | Alex Avron Point the Gap |
PowerSoC & PowerSiP markets are preparing. Are you? |
| 12:25 – 12:50 | Alex Lidow EPC |
Application of GaN-on-Silicon Technology in Advanced Power Conversion Systems |
| 12:50 – 13:15 | Indumini Ranmuthu Texas Instruments |
Challenges of integration of power supplies on chip |
| 13:15 – 13:40 | Arnold Knott Denmark Technical University |
PwrSoC enabling architectures in different applications |
| Session 2: Topologies and Control A Session Chairs: Aleksandar Prodic (U. Toronto), Jason T. Stauth (Darmouth College), Mor Peretz (Ben-Gurion Univ.) |
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| 15:30 – 15:55 | Jeff Morroni Texas Instruments |
Hybrid topologies |
| 15:55 – 16:20 | Dusan Graovac Infineon |
Embedded power technologies for automotive |
| 16:20 – 16:45 | Jason T. Stauth Dartmouth College |
Resonant switched-capacitors converters |
| 16:45 – 17:10 | Mor Peretz Ben Gurion University |
Fully-Integrated Digital Average Current-Mode Control Voltage Regulator Module IC |
| Tuesday, October 4 | ||
| Session 3: Power Semiconductor Technologies Session Chairs: Phil Rutter, Mete Erturk |
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| 9:00 – 9:25 | Greg Miller Sarda |
GaAs for High Frequency Miniaturized DC-DC conversion |
| 9:25- 9:50 | Ted Letavic Global Foundries |
RF LDMOS for highly integrated solutions |
| 9:50 – 10:15 | Mete Erturk Appulse Power |
A User’s Perspective of GaN and Si Power Devices for Integrated / Miniaturized Power Management |
| 10:15 – 10:40 | Tatsuo Morita Panasonic |
Monolithic integration of GaN power transistors integrated with gate drivers |
| Session 4: Magnetics Session Chairs: Maeve Duffy (NUI Galway), Charlie Sullivan (Dartmouth College), Ziwei Ouyang (DTU) |
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| 11:30 – 11:55 | Santosh Kulkarni, Bruno Allard Tyndall Institute & INSA Lyon |
Coupled inductors on silicon for PwrSoC in the frame of PowerSwipe project |
| 11:55 – 12:20 | Dragan Dinulovic Würth |
Microtransformer/Microinductor for Point-of-Load High Frequency DC-DC Converters |
| 12:20-12:55 | Antonio Camarda University of Bologna |
Design and Fabrication of Bond Wire Micro-magnetics with LTCC core |
| 12:55 – 13:20 | Charlie Sullivan Dartmouth College |
Geometries and fabrication processes for high-performance nano-granular magnetics on silicon |
| Session 5: Capacitors and Storage Devices Session Chairs: Mehdi Jatlaoui (IPDiA), Stephen O’Brien (CUNY) |
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| 14:40 – 15:00 | Raj Pulugurtha Georgia Tech |
Integration of pre-fabricated ultra-high density (1000 nF/mm2) capacitor films (50-75 microns) onto wafers and panels |
| 15:00 – 15:20 | Frederic Voiron IPDiA |
Advances in trench capacitors for interposer |
| 15:20 – 15:40 | Richard Percival, Denis Pasero ILIKA |
Energy Harvesting technology challenges |
| 15:40 – 16:00 | Nicolas Butzen KU Leuven |
Monolithic Switched-Capacitor Power Converters: Present Trends and Future Predictions |
| Session 6: Topologies and Control B Session Chairs: Peng Zou (Huawei), Christoph Sandner (Infineon), Luca Corradini (U. Padova) |
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| 16:20 – 16:40 | Brian Ma Univ. of Texas at Dallas |
Driving GaN Power Devices: Design Strategies and Circuit Techniques |
| 16:40 – 17:00 | Martin Haug Wurth |
Integrated wide-input range converters |
| 17:00 – 17:20 | Stefano Saggini Univ. of Udine |
Power MOS gating optimization for balancing efficiency vs. reliability in hard-switching converters |
| 17:20 – 17:40 | Amit Jain Intel |
FIVR Control topology and design for distributed loads |
| E-Posters Session Session Chairs: Jesús Oliver, Cristina Fernández, Santosh Kulkarni |
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| 18:00 – 20:00 | E-Posters Session | |
| Wednesday, October 5, 2016 | ||
| Session 7: System Integration, Packaging and Manufacturing Session Chairs:Alex Kalnitsky (TSMC), Noah Sturken (Ferric Semiconductor), Lou Hutter (SVP Dongbu Tech), Mike Hayes (Tyndal Institute) |
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| 9:00 – 9:25 | CT Wang TSMC |
Foundry WLSI technology for Power Management System Integration |
| 9:25 – 9:50 | Paul Brohlin Texas Instruments |
Electrical and thermal packaging challenges of GaN power devices |
| 9:50 – 10:15 | N. Sturcken Ferric |
DC-DC Power Conversion with CMOS Integrated Thin-Film Inductors |
| 10:15 – 10:40 | Madhavan Swaminathan Georgia Tech |
Integrated Voltage Regulators for Digital Applications |
| Session 8: Granular Power Session Chairs: Hanh-Phuc Le (U. Colorado), Rinkle Jain (Intel), Sungwoo Moon (Samsung), Gerard Villar-Piqué (NXP), Don Disney (GlobalFoundries) |
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| 11:30 – 11:55 | Tong Kim Samsung |
Mobile SOC PMIC for smartphone platform – from architecture design to development |
| 11:55 – 12:20 | Ken Shepard Columbia Univ. |
Integrated voltage regulators based on heterogeneous integration of magnetics and wide-bandgap semiconductors |
| 12:20 – 12:45 | Yan Lu University of Macau |
Ring-Shaped Multiphase Switched-Capacitor DC-DC Converters with Fast Transient Response and Small Ripple |
| 12:45 – 13:10 | Yogesh Ramadash Texas Instruments |
Hybrid switching converter architectures for powering processors and SoCs |
| 13:10 – 13:35 | Taner Dosluoglu Endura |
Challenges of CPU and GPU domain power delivery and solutions for next generation SoC Applications |
