| Monday, October 6 | ||
|---|---|---|
| Plenary Session Session Chair: Cian O’Mathuna (Tyndall Institute) |
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| 08:50 – 09:20 | Bruno Allard Ampere-Lab INSA Lyon |
 State of the art of high switching frequency inductive DC-DC converters in SoC context |
| 09:20 – 09:50 | Seth Sanders UC Berkeley |
The Road to Integrated Power Conversion via the Switched Capacitor Approach |
| 09:50 – 10:20 | Francesco Carobolante Qualcomm |
Power Supply on Chip: from R&D to commercial products |
| Session 1: Systems & Applications Session Chair: Jim Doyle (Qualcomm), Co-Chair: Francesco Carobolante (Qualcom) |
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| 11:05 – 11:30 | Dragan Maksimovic University of Colorado – Boulder |
Integration of GaN Supply Modulators and Radio-Frequency Power Amplifiers |
| 11:30 – 11:55 | Miguel Rodriguez AMD |
Server Power Delivery Challenges |
| 11:55 – 12:20 | Patrick Mercier UCSD |
Efficient on-chip power conversion for energy harvesting and low-power mobile applications |
| 12:20 – 12:45 | Zeynep Deniz IBM |
A Scalable Distributed Regulator Architecture for the POWER8TM Microprocessor |
| Session 2: Topologies and Control Session Chairs: Baoxing Chen (Analog Devices), José Cobos (University Polytechnic of Madrid), Aleks Prodic (University of Toronto), Eduard Alarcon (University Polytechnic Catalunya) |
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| 14:30 – 14:55 | David Perreault MIT |
Miniaturized High-Frequency Integrated Power Conversion for Grid Interface |
| 14:55 – 15:20 | Brian Ma Uni. Of Texas at Dallas |
VHF Switching Power Converters with 1A/ns Scale Load Current Slew Rate |
| 15:20 – 15:45 | S.M. Ahssanuzzaman Univ. of Toronto |
High Power Density Power Management IC Module with On-Chip Inductors |
| Session 2 : Topologies and Control (Continued) | ||
| 16:15 – 16;40 | Christophe Vaucourt Texas Instruments |
µDC/DC Modules: Fully Integrated DC-DC Converters |
| 16:40 – 17:05 | Christoph Sandner Infineon |
Towards a PowerSoC Solution for Automotive Microcontroller Applications |
| Tuesday, October 7 | ||
| Session 3: Power Semiconductor Technology Session Chairs: Don Disney (GLOBAL FOUNDRIES), IL-Yong Park (GLOBAL FOUNDRIES), Wai Tung Ng (University of Toronto) |
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| 08:00 – 08:25 | Francois Hebert Magnachip |
High-Frequency Power Management Technologies |
| 08:25 – 08:50 | Tomas Palacios MIT |
Seamless on-wafer integration of GaN and Si devices for the next generation of power management chips |
| 08:50 – 09:15 | Sameer Pendharkar Texas Instruments |
Silicon and package technology enabling high speed discrete and integrated lateral power devices |
| 09:15 – 09:40 | Phil Rutter NXP |
Optimizing Power MOSFET behavior for high frequency switching in DC-DC conversion |
| Session 4: Magnetics Session Chairs: Charles Sullivan (Thayer School of Engineering at Dartmouth), Sarah Bedair (US Army Research Lab) |
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| 10:30 – 10:55 | Noah Sturcken Ferric Semiconductor |
Integrated Voltage Regulation with Thin-Film Magnetic Core Power Inductors |
| 10:55 – 11:20 | Matthias Radecker Fraunhofer-Institut |
Galvanic Isolating Power Supplies with Piezoelectric Transformer: From PCB Integration to Chip Integration & from Analogue to Digital Driving |
| 11:20 – 11:45 | Gian Piazza Carnegie Mellon |
Thin Film High Frequency Piezoelectric Resonators |
| 11:45 – 12:10 | Mete Erturk Qualcomm |
Low-loss integrated 3D Solenoid Inductors For Switching Regulators |
| Session 5: Capacitors for Power Electronics Session Chairs: Stephen O’Brien (CUNY), Jason Stauth (Thayer School of Engineering at Dartmouth) |
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| 14:00 – 14:25 | Michael Baker Maxim |
Benefits of Monolithic Stacked—Wafer Capacitors for High—Frequency Buck Converters |
| 14:25 – 14:50 | Chengrui Le Columbia University |
Hybrid-Switched-Capacitor-Resonant DC-DC Converter for LED Driver Application |
| 14:50 – 15:15 | Mohamed Jatlaoui IPIDIA |
Silicon integrated capacitance for power conversion applications |
| 15:15 – 15:40 | Alex Kalnitsky TSMC |
High Density Capacitor for Power Management Applications and its Integration in the SiP |
| E-Posters Session Session Chairs: Xing Xing (Analog Devices), Jizheng Qiu (Maxim), Tao Wu (Intel), Seungbum Lim (MIT) |
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| Wednesday, October 8 | ||
| Session 6: System Integration, Packaging and Manufacturing Session Chairs: Mike Hayes (Tyndall Institute), Louis Burgyan (LTEC Corporation), Nick Renaud-Bezot (AT&S) |
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| 08:00 – 08:25 | Jelena Popovic Delft University of Technology |
Technology Platforms & Challenges for 3D GaN Power Converters Packaging |
| 08:25 – 08:50 | Nick Renaud-Bezot AT&S |
Considerations for Embedding Passives and Actives in PCBs |
| 08:50 – 09:15 | Steve Ziolkowski Advanced Semiconductor Engineering (ASE) |
An Outsourced Supplier Assembly and Test (OSAT) Perspective on Moving Up the Value Chain |
| 09:15 – 09:40 | José Cobos Technical University of Madrid (UPM) |
CAD tool to Optimize the Design of a PowerSoC Converter: Powerswipe Design Case |
| Session 7: Granular Power Session Chairs: Hanh-Phuc Le (Lion Semiconductor Inc.), Elad Alon (UC Berkeley), Bruno Allard (Ampere-Lab INSA Lyon), Christoph Sandner (Infineon), Seth Sanders (UC Berkeley) |
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| 10:35 – 11:00 | Rinkle Jain Intel |
Distributed Power Conversion – An Answer to Power Delivery Challenges in SoCs? |
| 11:00 – 11:25 | Jason Stauth Thayer School of Engineering at Dartmouth |
Resonant Switched Capacitor Converters for Chip-Scale Power Delivery |
| 11:25 – 11:50 | Robert Pilawa-Podgurski University of Illinois Urbana-Champaign |
Scalable series-stacked power delivery architectures for improved efficiency and reduced supply current |
| 11:50 – 12:15 | Toke Andersen ETH-Zurich, IBM |
Deep trench capacitor based on-chip switched capacitor voltage regulators for microprocessor power delivery |
| 12:15 – 12:40 | Hans Meyvaert KU Leuven |
Monolithic Capacitive Power Converters Towards Higher Voltage Conversion Ratios |
