| Session 1 | |
|---|---|
| Mark Gerber ASE US Inc. |
 Automotive IC Packaging: Evolving Power Solutions |
| Madhavan Swaminathan Georgia Tech |
Integrated Voltage Regulators for Computing Applications |
| Session 2 | |
|---|---|
| Ravi Mahajan Intel |
Advanced Packaging Architectures for Heterogeneous Integration |
| J. Mennen Belonio Dialog Semiconductor |
A Low Profile 2.5 SIP Package Technology using Thin ETS Substrate, for Wearable Applications |
| Karim Arabi Atlazo |
Power delivery in IoT applications with on device AI |
| Shuji Tsuchiya Shinko Electric Industries |
LF-MCeP High Thermal Performance Module for Power Supply |
| Steven Kummerl, Chuck Devries, Usman Chaudhry, Chong Hua Lim Arizona State University |
Increase power density and simplify designs using 3-D SiP modules |
