Those presentations not available are so indicated.
Wednesday, October 17th, 2018 |
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| 8:00 – 8:30 | Registration | |
| 8:30 – 8:40 | Mau-Chung Frank Chang, President, National Chiao Tung University, TaiwanKe-Horng Chen, Department Chair and Center Director, National Chiao Tung University, Taiwan |
Workshop Opening Welcome Address (Not Available) |
| 8:40 – 9:00 | Cian O’Mathuna Tyndall National Institute, Ireland |
PwrSoC Workshop – A Perspective of 10 Years’ Progress (Not Available) |
| Plenary Session Part 1 Session Chairs: |
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| Ke-Horng Chen NCTU, Taiwan |
Cian Ó Mathúna Tyndall National Institute, Ireland |
Seth Sanders UC Berkeley, U.S.A |
| 9:00 – 9:30 | Soh Yun Siah GLOBALFOUNDRIES, U.S.A. |
Heterogeneous Integration of GaN and Silicon for Power Conversion |
| 9:30 – 10:00 | Jim Doyle Dialog Semiconductor, U.S.A. |
A 100Mhz 8 amp 4 phase Buck with 87% efficiency Using a Low Cost 0.13u Process Providing Power for Mobile CPU and GPU and Evolution to Inductors on Die |
| 10:00 – 10:30 | Peng Zou Huawei, Peoples Republic of China |
A 100 MHz IVR PMIC with On-silicon Magnetic Thin Film Inductors |
| 10:30 – 10:50 | Tea Break | |
| Plenary Session Part 2 |
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| 10:50 – 11:20 | Louis Chen ASE, Taiwan |
New Generation Power Packaging Technology |
| 11:20 – 11:45 | Panel Discussion | |
| 11:45 – 13:00 | Lunch | |
| Session 1: Systems and Applications Session Chairs: |
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| José A. Cobos Universidad Politécnica de Madrid, Spain |
Francesco Carobolante U.S.A. | |
| 13:00 – 13.25 | Frank Praemassing Infineon Technologies |
Embedded Power Management for Automotive Microcontroller Units (MCUs) and Its Challenges |
| 13:25 – 13:50 | Arvind Sridhar IBM, Switzerland |
Advanced Power and Thermal Packaging Enabling Dense Integration of Compute Nodes |
| 13:50 – 14:15 | YanHai Cao ReSound, Denmark |
Sub-mW Integrated Power Management Systems for Hearing-aids Applications |
| 14:15 – 14:40 | Maurizio Granato, Texas Instruments, U.S.A. |
Integrated Power Management for Automotive SSR |
| 14:40 – 15:05 | Po-Hao Chang, MediaTek, Taiwan |
Signal and Power Integrity Analysis of InFO Interconnect for Networking Application |
| 15:05 – 15:30 | Panel Discussion | |
| 15:30 – 15:45 | Tea Break | |
| Session 2: Topologies and Control This session addresses powertrain circuits and controller design for on-chip and other power supplies targeting miniaturization or integration with loads. Session Chairs: |
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| Arnold Knott Danish Technical University, Denmark |
Jason Stauth Thayer School of Engineering, Dartmouth, U.S.A. |
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| 15:45 – 16:10 | Christopher Schaef Intel, U.S.A. |
Potential of Hybrid Converters in Compute Platform Power Delivery |
| 16:10 – 16:35 | Hanh-Phuc Le University of Colorado Boulder, U.S.A. |
Converter Topologies for Large Conversation Ratios: A Story from Switched-Capacitor to Hybrid Architectures |
| 16:35 – 17:00 | Toke Andersen Nordic Power Converters, Denmark |
Towards Integration of Offline Multi-MHz Power Supplies |
| 17:00 – 17:25 | Alexandre Prodic University of Toronto, Canada |
Control of Emerging Converter Topologies and High Performance Controllers for High-Frequency Low-Power SMPS |
| 17:25 – 17:50 | Panel Discussion | |
| 18:00 – 20:00 | Welcome Reception | |
Thursday, October 18th |
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| Session 3: Integrated Capacitors Devices Session Chairs: |
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| Mehdi Jatlaoui Murata, France |
Vincent Chou TSMC, Taiwan |
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| 8:00 – 8:25 | Markondeya Raj Georgia Tech, U.S.A. |
Reliability and Manufacturing Readiness of High-Density (1 µF/mm2) Ultra-thin (75 microns) Wafer- or Package-integrated Film Capacitors (Not available) |
| 8:25 – 8:50 | Jyun-Ying Lin TSMC, Taiwan |
Ultra High Density Capacitor for Power Management Applications |
| 8:50 – 9:15 | Frederic Nodet Murata, France |
Low Profile Integrated Silicon Capacitors Tailored for power supply on chip |
| 9:15 – 9:40 | Lu Ming ILIKA, People Republic of China |
Energy storage sources for autonomous IoT Sensing Devices |
| 9:40 – 10:05 | Panel Discussion | |
| 10:05 – 10:25 | Tea Break | |
| Session 4: Integrated Magnetics – Part 1 Session Chairs: |
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| Masahiro Yamaguchi Tohoku University, Japan |
Maeve Duffy NUI Galway, Ireland |
Charlie Sullivan Dartmouth College, U.S.A. |
| 10:25 – 10:50 | Toshiro Sato Shinshu University, Japan |
Fe-based Metal Composite Magnetic Core and its Application to High-frequency Switching DC-DC Converter |
| 10:50 – 11:15 | Noah Sturcken Ferric, U.S.A. |
Integrated Power Management with Ferromagnetic Thin-film Power Inductors |
| 11:15 – 11:40 | Paul McCloskey Tyndall Institute, Ireland |
Measurement Methodology and Inductor/transformer Updates |
| 11:40 – 12:40 | Lunch Break | |
| Session 4: Integrated Magnetics – Part 2 | ||
| 12:40 – 13:05 | Hoà Lê Thanh Technical University of Denmark |
3D Microfabricated Air-core Inductors for Integrated Power Supply |
| 13:05 – 13:30 | Baoxing Chen Analog Devices, U.S.A. |
Core and Winding Optimization of Micro-transformers for Isolated Power Conversion |
| 13:30 – 13:55 | Panel Discussion | |
| Session 5: Wide-Band Gap Semiconductors and Integration Session Chairs: |
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| Bernhard Wicht Leibniz Universität Hannover, Germany |
Brian Ma University of Texas, Dallas, U.S.A. |
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| 13:55 – 14:20 | Dan Kinzer Navitas, U.S.A. |
GaNFast PwrSoCs |
| 14:20 – 14:45 | Kenneth L. Shepard Columbia University, U.S.A. |
Hybrid Integrated GaN-CMOS Power Converters and High-density Modules Based on Vertical GaN Transistors |
| 14:45 – 15:10 | Jef Thoné MinDCet, Belgium |
Driving Wide Bandgap Transistors To The Limits |
| 15:10 – 15:35 | Kevin Chen Hong Kong Univ. of Science & Technology |
Understanding of Dynamic Behavior of GaN-on-Si Power Devices and ICs |
| 15:35 – 16:00 | Panel Discussion | |
| Posters Session Session Chairs: |
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| Chia-Ling Wei National Cheng Kung University |
Ningning Wang Hangzhou Dianzi University |
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| 16:00 – 18:00 | Poster Session (Posters are on the “PwrSoC 2018 Poster Presentations” page) | |
| 19:00 – 21:00 | Banquet | |
Friday, October 19th |
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| Session 6: System Integration, Packaging and Manufacturing Session Chairs: |
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| Hsiao-ching Tuan TSMC, Taiwan |
Lou Hutter Lou Hutter Consulting, U.S.A. |
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| 8:00 – 8:25 | HaoYi Ye Delta Electronics, Shanghai, Peoples Republic of China |
Power Efficiency Optimization in Data Center |
| 8:25 – 8:50 | Timothy Phillips Empower Semiconductor, U.S.A. |
Delivering the Inner Power of SoCs: The Value of Fully Integrated Voltage Regulator |
| 8:50 – 9:15 | Sreenivasan Koduri Texas Instruments, U.S.A. |
Package Impacts in Advanced Power Electronics |
| 9:15 – 9:40 | Sourabh Khandelwal Macquarie University, Australia |
GaN Device Model |
| 9:40 – 10:05 | Panel Discussion | |
| 10:05 – 10:20 | Tea Break | |
| Session 7: Granular Power Supply Session Chairs: |
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| Miguel Rodriguez AMD, U.S.A. |
Santosh Kulkarni Dialog Semiconductor, U.K. |
Rinkle Jain Intel U.S.A. |
| 10:20 – 10:45 | Pedro Bezerra ETH Zurich, Switzerland |
Towards the Integration of Voltage Regulators in Server Applications |
| 10:45 – 11:10 | Arijit Raychowdhury Georgia Tech, U.S.A. |
Non-linear Control for Linear Regulators |
| 11:10 – 11;35 | Rinkle Jain Intel, U.S.A. |
Fine Grain Voltage Domains on Graphics |
| 11:35 – 12:00 | Yan Lu, University of Macau, Peoples Republic of China |
Dual-Output Switched -Capacitor Power Converters |
| 12:00 – 12:25 | Panel Discussion | |
| 12:25 – 14:00 | Lunch & Wrap-up Meeting | |
| TSMC Technology Tour Tour Chair: Tour Guides: |
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| Group A | Group B | |
| 14:00 – 15:00 | Hsinchu Science Park | TSMC Museum of Innovation |
| 15:00 – 16:00 | TSMC Museum of Innovation | Hsinchu Science Park |
| 16:00 – 17:00 | TSMC Co. Profile & Power Technology | TSMC Co. Profile & Power Technology |
