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Wednesday, September 24th | ||
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| Time | Topic | ||
| 9:30 AM | Opening & Welcoming | ||
| 10:00 AM | Plenary Session 1
Innovations in Power Delivery to Meet Power Demands of High-Performance GPUs Kaladhar Radhakrishnan, Intel Fellow, Intel, U.S. |
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| 10:45 AM | Coffee Break | ||
| 11:20 AM | Plenary Session 2
Breaking Limit in Power Delivery: BSPDN and Its Synergy with DTCO Innovations Byung-Sung Kim, Vice President of Technology, Samsung Electronics, South Korea |
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| 12:10 PM | Lunch | ||
| 1:30 PM | Technical Session 1 Systems & Applications |
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| 3:10 PM | Poster Session & Coffee Break | ||
| 4:10 PM | Technical Session 2 Integrated Magnetics |
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| 6:30 PM | Welcome Reception | ||
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Thursday, September 25th | ||
| Time | Topic | ||
| 9:00 AM | Plenary Session 3
It’s Too Noisy! Issues with Voltage Noise in AI Workloads and Strategies to Minimize It Tezaswi Raja, Senior Director of Engineering, Nvidia, U.S. |
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| 9:45 AM | Coffee Break | ||
| 10:20 AM | Technical Session 3 Topologies & Control |
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| 12:00 PM | Lunch | ||
| 1:30 PM | Technical Session 4 Wide Band Gap Integration |
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| 3:10 PM | Poster Session & Coffee Break | ||
| 4:10 PM | Technical Session 5 System Integrated Packaging & Manufacturing |
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| 6:15 PM | Gala Dinner with Poster Award | ||
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Friday, September 26th | ||
| Time | Topic | ||
| 8:30 AM | Technical Session 6 Integrated Capacitors and Energy Storage |
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| 10:10 AM | Coffee Break | ||
| 10:40 AM | Technical Session 7 Granular Power Supply |
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| 12:20 PM | Lunch | ||
| 1:30 PM | Technical Tour SK Hynix |
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