|
Session |
Chairperson |
Affiliation |
|
|
Plenary Session |
Hyun-Sik Kim |
KAIST, South Korea |
|
|
Rinkle Jain |
Nvida, U.S. |
|
| Topic |
Speaker |
Affiliation |
|
Innovations in Power Delivery to Meet Power Demands of High-Performance GPUs |
Kaladhar Radhakrishnan |
Intel Fellow, Intel, U.S. |
|
Breaking Limit in Power Delivery: BSPDN and Its Synergy with DTCO Innovations |
Byung-Sung Kim |
Vice President of Technology, Samsung Electronics, South Korea |
|
(Tentative) It’s Too Noisy! Issues with Voltage Noise in AI Workloads and Strategies to Minimize It |
Tezaswi Raja |
Senior Director of Engineering, Nvidia, U.S. |
|
|
Granular Power Supply |
Christopher Schaef |
Microsoft, U.S. |
|
|
Cheng Huang |
Iowa State University, U.S. |
|
|
Amit Jain |
Intel, U.S. |
|
| Topic |
Speaker |
Affiliation |
|
Strong On-Die Inductor Technology and IVR Roadmap |
Ankush Gupta |
GlobalFoundries, U.S. |
|
Granular Power Management with Chip-Scale Voltage Regulators |
Noah Sturcken |
Ferric, U.S. |
|
(Tentative) Fully Monolithic Regulated Resonant DC-DC Converter |
Stefano Michelis |
CERN, Switzerland |
|
(Tentative) Modular Switched-Capacitor Converters for SoC Power Delivery |
Nicolas Butzen |
Intel, U.S. |
|
|
Topologies & Control |
Sung-Wan Hong |
Sogang University, South Korea |
|
|
Jason Stauth |
Dartmouth College, U.S. |
|
|
Mauro Leoncini |
Politecnico di Milano, Italy |
|
| Topic |
Speaker |
Affiliation |
|
Series of CF-Cross-Connected Converters |
Mo Huang |
University of Macau, Macau, China |
|
Powering AI: Challenges in VRM Control and Power Integration |
Stefano Saggini |
University of Udine, Italy |
|
Enabling Reliable Power for Autonomous EVs through PMIC Innovation |
Olivier Trescases |
University of Toronto, Canada |
|
Piezoelectric-Based Power Conversion: Towards Integration |
Jessica D. Boles |
University of California, Berkeley, U.S. |
|
|
Integrated Magnetics |
Kousuke Miyaji |
Shinshu University, Japan |
|
|
Matt Wilkowski |
Wurth Elektronik, Germany |
|
|
Maeve Duffy |
University of Galway, Ireland |
|
| Topic |
Speaker |
Affiliation |
|
MagPack™ Technology – New Power Modules Increasing the Power Density |
Kenji Kawano |
Texas Instruments, Japan |
|
High-Frequency DC/DC Buck Converter using a Thin-Film Silicon-Based Inductor |
Martin Sittner |
Wurth Elektronik, Germany |
|
Deposition and Characterization Advances in VHF Oxides for Monolithic Magnetics |
Alex Hanson |
University of Texas at Austin, U.S. |
|
Metal Chip Power Inductor for IVR Applications: High Performance with Customizable Flexibility |
Toshio Hiraoka |
Taiyo Yuden, Japan |
|
|
Wide Band Gap Integration |
Bernhard Wicht |
Leibniz University Hannover, Germany |
|
|
Wanyuan Qu |
Zhejiang University, China |
|
| Topic |
Speaker |
Affiliation |
|
(Tentative) GaN System Integration and Applications |
Anthony Sanders |
Infineon Technologies, Germany |
|
GaN Integrated Circuits for High-Density Power Conversion |
Sam Murray |
StarIC, Canada |
|
GaN-SIP Integration: Transforming the AC-DC Power Supply Market |
Michael Lueders |
Texas Instruments, Germany |
|
Pushing the Boundary of GaN Power Integration |
Kevin Jing Chen |
Hong Kong University of Science and Technology, Hong Kong, China |
|
|
Integrated Capacitors and Energy Storage |
Mohamed Mehdi Jatlaoui |
Murata, France |
|
|
Jaeil Baek |
KAIST, South Korea |
|
|
Markondeya Raj Pulugurtha |
Florida International University, U.S. |
|
| Topic |
Speaker |
Affiliation |
|
(Tentative) Deep Trench Capacitors |
TBD |
ELSPES, South Korea |
|
Enhancing Power Supply on Chip with Novel 3D Integrated Silicon Capacitors |
Mounir Hedir |
Murata, France |
|
TSV-based Stacked Silicon Capacitor with Embedded Package Platform |
Kyojin Hwang |
Samsung Electronics, South Korea |
|
High-Density 3D-Integrated Silicon Capacitors for Advanced Power Conversion Applications |
Sami Oukassi |
CEA-Leti, France |
|
|
System Integrated Packaging & Manufacturing |
Sang Won Yoon |
Seoul National University, South Korea |
|
|
Hongbin Yu |
Arizona State University, U.S. |
|
|
Cian O’Mathuna |
Tyndall National Institute, Ireland |
|
| Topic |
Speaker |
Affiliation |
|
Scalable Liquid Cooling for Evolving High-Power Processor Packages |
TBD |
Nexalus, Ireland |
|
A Novel Capacitor-Embedded Substrate Technology for Next Generation Power Supply Applications |
Kazuki Itoyama |
Murata, Japan |
|
Scalable Manufacturing of Inductor and Capacitor IPD Arrays for Higher Power Handling and Efficiency with Advanced Processes |
TBD |
Applied Materials, U.S. |
|
TBD |
John McDonald |
Atlas Magnetics, U.S. |
|
|
Systems & Applications |
Raveesh Magod |
Texas Instruments, U.S. |
|
|
Se-Un Shin |
Pohang University of Science and Technology, South Korea |
|
|
Francesco Carobolante |
Intel, U.S. |
|
| Topic |
Speaker |
Affiliation |
|
(Tentative) IVR Integration for Data Center SoCs |
Serhii Zhak |
Renesas Electronics, U.S. |
|
(Tentative) Integrated 48V to 1V Converters |
Harish Krishnamurthy |
Intel, U.S. |
|
(Tentative) System Design Using Converters and Modules for Servers/AI processors |
John Broze |
Texas Instruments, U.S. |
|
Integrated Circuit Techniques for Miniature and Efficient Vibration Energy Harvesting Systems |
Sijun Du |
Delft University of Technology, The Netherlands |
|
Poster Session |
Hyung-Min Lee |
Korea University, South Korea |
|
|
Trifon Liakopoulos |
EnaChip, U.S. |
