|
Session |
Chairperson |
Affiliation |
|
|
Plenary Session |
|
|
|
| Topic |
Speaker |
Affiliation |
|
Powering an Intelligent World |
Soh Yun Siah |
Technology Vice President, GlobalFoundries, Singapore |
|
|
Granular Power Supply |
Xun Liu |
The Chinese University of Hong Kong, China |
|
|
Yasser Nour |
Lotus Microsystems, Denmark |
|
| Topic |
Speaker |
Affiliation |
|
Current-Shared Multi-Phase FIVRs with Phase-Shedding-Optimized AC Dynamics |
Hyun-sik Kim |
School of Electrical Engineering KAIST, South Korea |
|
Integrated Power Electronics for Heterogenous Integration |
Hanh-Phuc Le |
University of California San Diego, U.S. |
|
New Architecture for Fully Integrated Granular Power Supplies |
Santosh Kulkarni |
Renesas Electronics, U.K. |
|
Modular LDO and EDA Technology for Agile Design |
Xiaosen Liu |
Tsinghua University, China |
|
|
Topologies & Control |
Yogesh Ramadass |
Texas Instruments, Santa Clara, U.S. |
|
|
Yan Lu |
University of Macau, China |
|
| Topic |
Speaker |
Affiliation |
|
Finding the Best Topology for the Job: Quantitative Methods for Evaluating Performance of Hybrid Switched-Capacitor DC-DC Converter Topologies |
Robert Pilawa-Podgurski |
University of California Berkeley, U.S. |
|
Hybrid DC-DC Converters and the Applications for Processor Power Delivery |
Wanyuan Qu |
Zhejiang University, China |
|
Miniaturizing Galvanically Isolated Power Supplies for Integration in Semiconductor Products |
Tim Merkin |
Texas Instruments, U.S. |
|
Hybrid Switched Capacitor Converters for 48 V Data-Center Applications |
Roberto Rizzolatti |
Infineon, Austria. |
|
|
Integrated Magnetics |
Cian O’Mathuna |
Tyndall National Institute, University College Cork, Ireland |
|
|
Maeve Duffy |
University of Galway, Ireland |
|
|
Marc Wurz |
University of Hannover, Germany |
|
| Topic |
Speaker |
Affiliation |
|
High Performance Metal Chip Power Inductor for IVR |
Toshio Hiraoka |
Taiyo Yuden, Japan |
|
Manufacturing of Plastic-Based Inductors – A New Approach |
Sebastian Bengsch |
Ensinger, Germany |
|
Scalable Integrated Magnetics: A Cost-Effective and Efficient Solution for Vertical Power |
Trifon Liakopoulos |
EnaChip, U.S. |
|
Magnetic Material on Silicon for Future Power Inductor Technology |
Ranajit Sai |
Tyndall National Institute, Ireland |
|
|
Wide Band Gap Integration |
Rinkle Jain |
Intel, U.S. |
|
|
Ke-Horng Chen |
National Yang Ming Chiao Tung University, Taiwan |
|
| Topic |
Speaker |
Affiliation |
|
GaN Discrete Devices for Portable and Computing Applications |
Jan Sonsky |
Innoscience, Belgium |
|
Non-Isolated High Voltage Point-of-Load DC-DC Converters for High Performance Computing |
Arijit Raychowdhury |
Georgia Institute of Technology, U.S. |
|
GaN Chip Implementation Platform |
Hann-Huei Tsai |
NARLabs, TSRI, Taiwan |
|
GaN-on-Si Process Featuring GaN MOSHEMT Transistor Technology and Integrated Silicon CMOS on 300mm Wafers |
Han Wui Then |
Intel, U.S. |
|
|
Integrated Capacitors and Energy Storage |
Kousuke Miyaji |
Shinshu University, Japan |
|
|
Dina Reda Eldamak |
German University in Cairo, Egypt |
|
| Topic |
Speaker |
Affiliation |
|
Improving High Voltage Power Modules with New Silicon Snubber Capacitor Technology |
Rémy Cannaya |
Murata, France |
|
CeraCharge™ – World’s First Rechargeable Solid-State SMD Battery |
Hiroshi Sato |
TDK, Japan |
|
3D Silicon Capacitor Technology – Versatile Integration Capability for both High Voltage and High Frequency Applications |
Norman Böttcher |
Fraunhofer IISB, Germany |
|
Next-Generation Switched-Capacitor Converters using High-Density On-Die MIM Capacitors |
Nicolas Butzen |
Intel, U.S. |
|
|
System Integrated Packaging & Manufacturing |
Min Chen |
Innoscience, U.S. |
|
|
Tina Thomas |
Fraunhofer IZM, Germany |
|
| Topic |
Speaker |
Affiliation |
|
Buck PwrSoC Integrated on Magnetic Substrate Laminate |
Jerry Zhai |
SG Micro Corp, China |
|
Novel In-Situ Button Shear Methodology for Assessment of the Adhesion Strength of Epoxy Mold Compound in E-mobility Power Module |
David Guillon |
Hitachi Energy, Switzerland |
|
Novel and Lightweight 1200V SiC Power Module with Direct-Cooled Substrate |
Fabio Bernardi |
Magneti Marelli, Italy |
|
High Frequency Power Conversion for mW and kW |
Eckart Hoene |
Fraunhofer IZM, Germany |
|
|
Systems & Applications |
José Cobos |
Technical University of Madrid, Spain |
|
|
Francesco Carobolante |
IoTissimo, U.S. |
|
| Topic |
Speaker |
Affiliation |
|
Miniature High Frequency Auxiliary DC-DC Converter Based on an Improved Thin-Film Microinductor |
Martin Sittner |
Würth Elektronik, Germany |
|
Unlocking the Full Potential of Switched-Capacitor Power Conversion: Advanced Switched-Capacitor Integrated Circuits for Next-Generation Applications |
Pere Llimós Muntal |
Skycore, Denmark |
|
Challenges for Integration of Power Management Solutions on STM32 µControllers |
David Chesneau |
STMicroelectronics, France |
|
Chip-Scale High-Voltage Power Supplies |
Bernhard Wicht |
Leibniz University Hannover, Germany |
|
Poster Session |
Jens Friebe |
University of Kassel, Germany |
|
|
Aleksandar Prodic |
University of Toronto, Canada |
