– PwrPACK 2019 HOME – – COMMITTEES – – REGISTRATION – – KEY NOTE SPEAKERS –
– VENUE – – HOTEL –
| Thursday October 31, 2019 | ||
| 10:00 – 1:00 | Registration | |
| 1:00 – 1:15 | Hongbin Yu, Arizona State University, Workshop General Chair Welcome to ASU by Bertan Bakkaloglu |
Workshop Opening & Welcome Address |
| Keynote Speaker Introduction by: Jim Doyle, Dialog Semiconductor, Technical Program Co-Chair |
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| 1:15 – 1:45 | Cian O’Mathuna, Tyndall National Institute, Ireland | PwrSoC Workshop – A Perspective of PwrSoC Progress |
| Session 1 – Integration Session Co-Chairs: Francesco Carobolante, IoTissimo, and Ambreesh Bhattad, Dialog Semiconductor |
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| 1:45 – 2:15 | Seungki Nam, Samsung | Power Intergrity Challenges and Design Strategies by Power Consumption Level |
| 2:15 – 2:45 | Alexander Kalnitsky, TSMC and Noah Sturcken, Ferric, Inc. |
TSMC IVR Infra-structure |
| 2:45 – 3:15 | Break | |
| 3:15 – 3:45 | Mark Gerber, ASE US | Automotive IC Packaging: Evolving Power Solutions |
| 3:45 – 4:15 | Shuji Tsuchiya, Shinko | LF-MCeP: High Thermal Performance Module for Power Devices |
| 4:15 – 4:45 | Panel Questions | |
| 6:00 – 10:00 | Workshop Dinner Reception – Fate Brewing Company | |
| Friday November 1, 2019 | ||
| 7:00 – 8:00 | Workshop Breakfast – SkySong Building 3 | |
| Keynote Speaker Introduction by: Vasudeva Alturi, Renavitas Technologies, Session Co-Chair |
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| 8:00 – 8:30 | Ravi Mahajan, Intel Corporation. | Advanced Packaging Architectures for Heterogeneous Integration |
| Session 2 – Packaging Session Co-Chairs: Vasudeva Atluri, Renavitas Technologies, and Jihong Ren, Facebook |
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| 8:30 – 9:00 | Chung-Hao Tsai, TSMC | Power Delivery Design and Performance of CoWoS System with Embedded Capacitor |
| 9:00 – 9:30 | J. Mennen Belonio, Dialog Semiconductor | A Low Profile 100MHz PSIP PMIC with internal discrete components |
| 9:30 – 10:00 | Break | |
| 10:00 – 10:30 | Karim Arabi, Atlazo | Power Delivery in IoT Application |
| 10:30 – 11:00 | Madhavan Swaminathan, Georgia Tech | Integrated Voltage Regulators for Computing Applications |
| 11:00 – 11:30 | Steve Kummerl, Texas Instruments | Increase Power Density and Simplify Designs Using 3-D SiP Modules |
| 11:30 – 12:00 | Panel Questions | |
| 12:00 – 1:30 | Workshop Luncheon – SkySong Building 3 | |
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