Schedule

Program at a glance

pwrSoC2016_at_a Glance

 

Detailed Schedule – DRAFT

Monday, October 3rd, 2016
 8:00 – 9:00 Registration and Breakfast
 9:00 – 9: 30 Workshop Opening
Plenary Session
Session Chair: Cian O’Mathuna
 9:30 – 9:55 Sam Naffziger
AMD
Integrated Power Conversion Strategies across Laptop, Server and Graphics Products
9:55 – 10:20 Baoxing Chen
Analog Devices
Air core and magnetic core transformers for isolated power conversion
10:20 – 10:45 P. Chu
TSMC
GaN device manufacturing
 10:45 – 11:10 Gerald Weidinger
AT&S
Close supply chain collaboration enables easy implementation of chip embedded power SiP
 11:10 – 11:30 Panel Q&A
 11:30 – 12:00  Coffee Break
Session 1: Systems and Applications
Session Chairs: Francesco Carobolante (Qualcomm), Sami Ajram (SL3J systems)
 12:00 – 12:25 Alex Avron
Point the Gap
 PowerSoC & PowerSiP markets are preparing. Are you?
 12:25 – 12:50 Alex Lidow
EPC
Application of GaN-on-Silicon Technology in Advanced Power Conversion Systems
 12:50 – 13:15 Indumini Ranmuthu
Texas Instruments
Challenges of integration of power supplies on chip
 13:15 – 13:40 Arnold Knott
Denmark Technical University
PwrSoC enabling architectures in different applications
 13:40 – 14:00 Panel Q&A
 14:00 – 15:30  Lunch
Session 2: Topologies and Control A
Session Chairs: Aleksandar Prodic (U. Toronto), Jason T. Stauth (Darmouth College), Mor Peretz (Ben-Gurion Univ.)
 15:30 – 15:55 Jeff Morroni
Texas Instruments
Hybrid topologies
 15:55 – 16:20 Dusan Graovac
Infineon
Embedded power technologies for automotive
 16:20 – 16:45 Jason T. Stauth
Dartmouth College
Resonant switched-capacitors converters
 16:45 – 17:10 Mor Peretz
Ben Gurion University
Fully-Integrated Digital Average Current-Mode Control Voltage Regulator Module IC
 17:10 – 17:30 Panel Q&A
17:30 – 19:00 Visit to CEI Lab
 19:00 – 21:00 Welcome Cocktail
Tuesday, October 4
8:00 – 9:00 Breakfast
Session 3: Power Semiconductor Technologies
Session Chairs: Phil Rutter, Mete Erturk
 9:00 – 9:25 Greg Miller
Sarda
GaAs for High Frequency Miniaturized DC-DC conversion
 9:25- 9:50 Ted Letavic
Global Foundries
RF LDMOS for highly integrated solutions
 9:50 – 10:15 Mete Erturk
Appulse Power
A User’s Perspective of GaN and Si Power Devices for Integrated / Miniaturized Power Management
 10:15 – 10:40 Tatsuo Morita
Panasonic
Monolithic integration of GaN power transistors integrated with gate drivers
 10:40 – 11:00 Panel Q&A
 11:00 – 11:30 Coffee Break
Session 4: Magnetics
Session Chairs: Maeve Duffy (NUI Galway), Charlie Sullivan (Dartmouth College), Ziwei Ouyang (DTU)
 11:30 – 11:55 Santosh Kulkarni, Bruno Allard
Tyndall Institute & INSA Lyon
Coupled inductors on silicon for PwrSoC in the frame of PowerSwipe project
11:55 – 12:20 Dragan Dinulovic
Würth
Microtransformer/Microinductor for Point-of-Load High Frequency DC-DC Converters
12:20-12:55 Antonio Camarda
University of Bologna
Design and Fabrication of Bond Wire Micro-magnetics with LTCC core
 12:55 – 13:20 Charlie Sullivan
Dartmouth College
Geometries and fabrication processes for high-performance nano-granular magnetics on silicon
 13:20 – 13:30 Panel Q&A
 13: 30 – 14:40 Lunch
Session 5: Capacitors and Storage Devices
Session Chairs: Mehdi Jatlaoui (IPDiA), Stephen O’Brien (CUNY)
 14:40 – 15:00 Raj Pulugurtha
Georgia Tech
Integration of pre-fabricated ultra-high density (1000 nF/mm2) capacitor films (50-75 microns) onto wafers and panels
 15:00 – 15:20 Frederic Voiron
IPDiA
Advances in trench capacitors for interposer
 15:20 – 15:40 Richard Percival, Denis Pasero
ILIKA
Energy Harvesting technology challenges
 15:40 – 16:00 Nicolas Butzen
KU Leuven
Monolithic Switched-Capacitor Power Converters: Present Trends and Future Predictions
 16:00 – 16:20 Panel Q&A
Session 6: Topologies and Control B
Session Chairs: Peng Zou (Huawei), Christoph Sandner (Infineon), Luca Corradini (U. Padova)
16:20 – 16:40 Brian Ma
Univ. of Texas at Dallas
Driving GaN Power Devices: Design Strategies and Circuit Techniques
16:40 – 17:00 Martin Haug
Wurth
Integrated wide-input range converters
17:00 – 17:20 Stefano Saggini
Univ. of Udine
Power MOS gating optimization for balancing efficiency vs. reliability
in hard-switching converters
 17:20 – 17:40 Amit Jain
Intel
FIVR Control topology and design for distributed loads
 17:40 – 18:00 Panel Q&A
E-Posters Session
Session Chairs: Jesús Oliver, Cristina Fernández, Santosh Kulkarni
 18:00 – 20:00 E-Posters Session
 21:00 – 23:00   Banquet
Wednesday, October 5, 2016
Session 7: System Integration, Packaging and Manufacturing
Session Chairs:Alex Kalnitsky (TSMC), Noah Sturken (Ferric Semiconductor), Lou Hutter (SVP Dongbu Tech), Mike Hayes (Tyndal Institute)
 9:00 – 9:25 CT Wang
TSMC
Foundry WLSI technology for Power Management System Integration
 9:25 – 9:50 Paul Brohlin
Texas Instruments
Electrical and thermal packaging challenges of GaN power devices
 9:50 – 10:15 N. Sturcken
Ferric
DC-DC Power Conversion with CMOS Integrated Thin-Film Inductors
 10:15 – 10:40 Madhavan Swaminathan
Georgia Tech
Integrated Voltage Regulators for Digital Applications
 10:40 – 11:00 Panel Q&A
 11:00 – 11:30   Coffee Break
Session 8: Granular Power
Session Chairs: Hanh-Phuc Le (U. Colorado), Rinkle Jain (Intel), Sungwoo Moon (Samsung), Gerard Villar-Piqué (NXP), Don Disney (GlobalFoundries)
11:30 – 11:55 Tong Kim
Samsung
Mobile SOC PMIC for smartphone platform – from architecture design to development
11:55 – 12:20 Ken Shepard
Columbia Univ.
Integrated voltage regulators based on heterogeneous integration of magnetics and wide-bandgap semiconductors
12:20 – 12:45 Yan Lu
University of Macau
Ring-Shaped Multiphase Switched-Capacitor DC-DC Converters with Fast Transient Response and Small Ripple
12:45 – 13:10 Yogesh Ramadash
Texas Instruments
 Hybrid switching converter architectures for powering processors and SoCs
 13:10 – 13:35 Taner Dosluoglu
Endura
Challenges of CPU and GPU domain power delivery and solutions for next generation SoC Applications
 13:35 – 14:00 Panel Q&A
 14:00 – 15:30 Lunch
 15:30 – 16:00 Wrap – up and discussion
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