Schedule

Program Detailed Schedule

Wednesday, October 17th, 2018

8:00 – 8:30 Registration
8:30 – 8:40 Mau-Chung Frank Chang,
President, National Chiao Tung University, TaiwanKe-Horng Chen,
Department Chair and Center Director,
National Chiao Tung University, Taiwan
Workshop Opening Welcome Address
8:40 – 9:00 Cian O’Mathuna
Tyndall National Institute, Ireland
PwrSoC Workshop – A Perspective of 10 Years’ Progress
Plenary Session Part 1
Session Chairs:
 Ke-Horng Chen
NCTU, Taiwan
Cian Ó Mathúna
Tyndall National Institute, Ireland
Seth Sanders
UC Berkeley, U.S.A
 
9:00 – 9:30 Don Disney
GLOBALFOUNDRIES, U.S.A.
Heterogeneous Integration of GaN and Silicon for Power Conversion
9:30 – 10:00 Jim Doyle
Dialog Semiconductor, U.S.A.
A 100Mhz 8 amp 4 phase Buck with 87% efficiency Using a Low Cost 0.13u Process Providing Power for Mobile CPU and GPU and Evolution to Inductors on Die
10:00 – 10:30 Peng Zou
Huawei, Peoples Republic of China
A 100 MHz IVR PMIC with On-silicon Magnetic Thin Film Inductors
10:30 – 10:50 Tea Break
Plenary Session Part 2
10:50 – 11:20 Louis Chen
ASE, Taiwan
New Generation Power Packaging Technology
11:20 – 11:45 Panel Discussion
11:45 – 13:00 Lunch
Session 1: Systems and Applications
Session Chairs:
José A. Cobos
Universidad Politécnica de Madrid, Spain
Francesco Carobolante U.S.A.  
13:00 – 13.25 Frank Praemassing
Infineon Technologies
Embedded Power Management for Automotive Microcontroller Units (MCUs) and Its Challenges
13:25 – 13:50 Arvind Sridhar
IBM, Switzerland
Advanced Power and Thermal Packaging Enabling Dense Integration of Compute Nodes
13:50 – 14:15 YanHai Cao
ReSound, Denmark
Sub-mW Integrated Power Management Systems for Hearing-aids Applications
14:15 – 14:40 Maurizio Granato,
Texas Instruments, U.S.A.
Integrated Power Management
for Automotive SSR
14:40 – 15:05 Po-Hao Chang,
MediaTek, Taiwan
Signal and Power Integrity Analysis of InFO Interconnect for Networking Application
15:05 – 15:30 Panel Discussion
15:30 – 15:45 Tea Break
Session 2: Topologies and Control
This session addresses powertrain circuits and controller design for on-chip and other power supplies targeting miniaturization or integration with loads.
Session Chairs:
Arnold Knott
Danish Technical University, Denmark
Jason Stauth
Thayer School of Engineering, Dartmouth, U.S.A.
 
15:45 – 16:10 Christopher Schaef
Intel, U.S.A.
Potential of Hybrid Converters in Compute Platform Power Delivery
16:10 – 16:35 Hanh-Phuc Le
University of Colorado Boulder, U.S.A.
Converter Topologies for Large Conversation Ratios: A Story from Switched-Capacitor to Hybrid Architectures
16:35 – 17:00 Toke Andersen
Nordic Power Converters, Denmark
Towards Integration of Offline Multi-MHz Power Supplies
17:00 – 17:25 Alexandre Prodic
University of Toronto, Canada
Control of Emerging Converter Topologies and High Performance Controllers for High-Frequency Low-Power SMPS
17:25 – 17:50 Panel Discussion
18:00 – 20:00 Welcome Reception

Thursday, October 18th

Session 3: Integrated Capacitors Devices
Session Chairs:                      
Mehdi Jatlaoui
Murata, France 
Vincent Chou
TSMC, Taiwan
8:00 – 8:25 Markondeya Raj
Georgia Tech, U.S.A.
Reliability and Manufacturing Readiness of High-Density (1 µF/mm2) Ultra-thin (75 microns) Wafer- or Package-integrated Film Capacitors
8:25 – 8:50 Jyun-Ying Lin
TSMC, Taiwan
Ultra High Density Capacitor for Power Management Applications
8:50 – 9:15 Frederic Nodet
Murata, France
Low Profile Integrated Silicon Capacitors Tailored for power supply on chip
9:15 – 9:40 Lu Ming
ILIKA, People Republic of China
Energy storage sources for autonomous IoT Sensing Devices
9:40 – 10:05 Panel Discussion
10:05 – 10:25 Tea Break
Session 4: Integrated Magnetics – Part 1
Session Chairs:                    
Masahiro Yamaguchi
Tohoku University, Japan
Maeve Duffy
NUI Galway,  Ireland 
Charlie Sullivan
Dartmouth College, U.S.A.
10:25 – 10:50 Toshiro Sato
Shinshu University, Japan
Fe-based Metal Composite Magnetic Core and its Application to High-frequency Switching DC-DC Converter
10:50 – 11:15 Noah Sturcken
Ferric, U.S.A.
Integrated Power Management with Ferromagnetic Thin-film Power Inductors
11:15 – 11:40 Paul McCloskey
Tyndall Institute, Ireland
Measurement Methodology and Inductor/transformer Updates
11:40 – 12:40 Lunch Break
Session 4: Integrated Magnetics – Part 2
12:40 – 13:05 Hoà Lê Thanh
Technical University of Denmark
3D Microfabricated Air-core Inductors for Integrated Power Supply
13:05 – 13:30 Baoxing Chen
Analog Devices, U.S.A.
Core and Winding Optimization of Micro-transformers for Isolated Power Conversion
13:30 – 13:55 Panel Discussion
Session 5: Wide-Band Gap Semiconductors and Integration
Session Chairs:
Bernhard Wicht
Leibniz Universität Hannover, Germany
Brian Ma
University of Texas, Dallas, U.S.A.
 
13:55 – 14:20 Dan Kinzer
Navitas, U.S.A.
GaNFast PwrSoCs
14:20 – 14:45 Kenneth L. Shepard
Columbia University, U.S.A.
Hybrid Integrated GaN-CMOS Power Converters and High-density Modules Based on Vertical GaN Transistors
14:45 – 15:10 Jef Thoné
MinDCet, Belgium
Driving Wide Bandgap Transistors To The Limits
15:10 – 15:35 Kevin Chen
Hong Kong Univ. of Science & Technology
Understanding of Dynamic Behavior of GaN-on-Si Power Devices and ICs
15:35 – 16:00 Panel Discussion
Posters Session
Session Chairs:
Chia-Ling Wei
National Cheng Kung University
Ningning Wang
Hangzhou Dianzi University
 
16:00 – 18:00 Poster Session
19:00 – 21:00   Banquet

Friday, October 19th

Session 6: System Integration, Packaging and Manufacturing
Session Chairs:
Hsiao-ching Tuan
TSMC, Taiwan
Lou Hutter
Lou Hutter Consulting, U.S.A.
8:00 – 8:25 HaoYi Yeh
Delta Electronics, Shanghai, Peoples Republic of China
Power Efficiency Optimization in Data Center
8:25 – 8:50 Timothy Phillips
Empower Semiconductor, U.S.A.
Delivering the Inner Power of SoCs: The Value of Fully Integrated Voltage Regulator
8:50 – 9:15 Sreenivasan Koduri
Texas Instruments, U.S.A.
Package Impacts in Advanced Power Electronics
9:15 – 9:40 Sourabh Khandelwal 
Macquarie University, Australia
GaN Device Model
9:40 – 10:05 Panel Discussion
10:05 – 10:20   Tea Break
Session 7: Granular Power Supply
Session Chairs:                                                 
Miguel Rodriguez
AMD, U.S.A.
Santosh Kulkarni
Dialog Semiconductor, U.K.
Rinkle Jain
Intel  U.S.A.
10:20 – 10:45 Pedro Bezerra
ETH Zurich, Switzerland
Towards the Integration of Voltage Regulators in Server Applications
10:45 – 11:10 Arijit Raychowdhury
Georgia Tech, U.S.A.
Non-linear Control for Linear Regulators
11:10 – 11;35 Rinkle Jain
Intel, U.S.A.
Fine Grain Voltage Domains on Graphics
11:35 – 12:00 Yan Lu,
University of Macau, Peoples Republic of China
Dual-Output Switched -Capacitor Power Converters
12:00 – 12:25 Panel Discussion
12:25 – 14:00 Lunch & Wrap-up Meeting
TSMC Technology Tour
Tour Chair:
Tour Guides:
Group A Group B
14:00 – 15:00 Hsinchu Science Park  TSMC Museum of Innovation
15:00 – 16:00 TSMC Museum of Innovation  Hsinchu Science Park
16:00 – 17:00  TSMC Co. Profile & Power Technology  TSMC Co. Profile & Power Technology

 

 

 

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